Browse "College of Engineering(공과대학)" by Type Article
Showing results 14401 to 14420 of 63244
| Damage-free cutting of chemically strengthened glass by creation of sub-surface cracks using femtosecond laser pulses Park, Sanguk; Kim, Yunseok; You, Joonho; Kim, Seung-Woo, CIRP ANNALS-MANUFACTURING TECHNOLOGY, v.66, no.1, pp.535 - 538, 2017 |
| Damage-free low temperature pulsed laser printing of gold nanoinks on polymers Chung, J; Ko, Seung Hwan; Grigoropoulos, CP; Bieri, NR; Dockendorf, C; Poulikakos, D, JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, v.127, no.7, pp.724 - 732, 2005-07 |
| Damage-induced deflection approach for damage localization and quantification of shear buildings: validation on a full-scale shear building Sung, Seung-Hun; Koo, KY; Jung, Ho-Yeon; Jung, Hyung-Jo, SMART MATERIALS AND STRUCTURES, v.21, no.11, 2012-11 |
| Damage-resistant brittle coatings Lawn, BR; Lee, KS; Chai, H; Pajares, A; Kim, Do Kyung; Wuttiphan, S; Peterson, IM; et al, ADVANCED ENGINEERING MATERIALS, v.2, no.11, pp.745 - 748, 2000-11 |
| Damköhler수 변화에 따른 고체연료확산화염의 구조 및 거동 김정수; 백승욱, 한국항공우주학회지, v.20, no.2, pp.78 - 90, 1992-06 |
| Damping behavior of Al-Zn alloys produced by spray forming process b.c.moon; z.h.lee, SCRIPTA MATERIALIA, v.38, no.2, pp.207 - 213, 1997 |
| Damping characteristics of composite hybrid spindle covers for high speed machine tools Suh, JD; Chang, SH; Lee, Dai Gil; Choi, JK; Park, BS, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.113, no.1-3, pp.178 - 183, 2001-06 |
| Damping Characteristics of Cylindrical Laminates with Viscoelastic Layer Considering Temperature- and Frequency-Dependence Oh, Il-Kwon, JOURNAL OF THERMAL STRESSES, v.32, no.1-2, pp.1 - 20, 2009 |
| Damping characteristics of SMA films and their application for passive vibration isolation Roh, Jin-Ho; Lee, In; Han, Jae-Hung, INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS, v.27, no.3, pp.225 - 241, 2008 |
| Damping enhancement of rubber dampers for high speed compact disk players Chang, SH; Choi, JK; Lee, Dai Gil; Kim, HS, POLYMER ENGINEERING AND SCIENCE, v.39, no.9, pp.1642 - 1650, 1999-09 |
| Damping improvement of machine tool columns with polymer matrix fiber composite material Lee, Dai Gil; Chang, SH; Kim, HS, COMPOSITE STRUCTURES, v.43, no.2, pp.155 - 163, 1998-10 |
| Damping properties and transmission loss of polyurethane. I. Effect of soft and hard segment compositions Yoon, KH; Yoon, ST; Park, OOk, JOURNAL OF APPLIED POLYMER SCIENCE, v.75, no.5, pp.604 - 611, 2000-01 |
| Damping-Induced Self Recovery Phenomenon in Mechanical Systems With an Unactuated Cyclic Variable Chang, Dong Eui; Jeon, Soo, JOURNAL OF DYNAMIC SYSTEMS MEASUREMENT AND CONTROL-TRANSACTIONS OF THE ASME, v.135, no.2, 2013-03 |
| DAN3D 모형을 이용한 우면산 토석류 거동 수치모의 이득환; 이승래; 박준영, 한국방재학회논문집, v.19, no.3, pp.195 - 202, 2019-06 |
| Dantzig-Wolfe decomposition approach to the vehicle assignment problem with demand uncertainty in a hybrid hub-and-spoke network Choi, Jiyoung; Lee, Chungmok; Park, Sungsoo, ANNALS OF OPERATIONS RESEARCH, v.264, no.1-2, pp.57 - 87, 2018-05 |
| DAPPER: Label-Free Performance Estimation after Personalization for Heterogeneous Mobile Sensing Gong, Taesik; Kim, Yewon; Orzikulova, Adiba; Liu, Yunxin; Hwang, Sung Ju; Shin, Jinwoo; Lee, Sung-Ju, PROCEEDINGS OF THE ACM ON INTERACTIVE MOBILE WEARABLE AND UBIQUITOUS TECHNOLOGIES-IMWUT, v.7, no.2, 2023-06 |
| DARCAS: Dynamic Association Regulator Considering Airtime Over SDN-Enabled Framework Salman, Muhammad; Son, Jin-Ho; Choi, Dong-Wan; Lee, Uichin; Noh, Youngtae, IEEE INTERNET OF THINGS JOURNAL, v.9, no.20, pp.20719 - 20732, 2022-10 |
| Dark energy in hybrid inflation Gong J.-O.; Kim, Sung Chul, PHYSICAL REVIEW D, v.75, no.6, 2007 |
| Dark Synthetic Vision: Lightweight Active Vision to Navigate in the Dark Kim, Joowan; Jeon, Myung-Hwan; Cho, Younggun; Kim, Ayoung, IEEE ROBOTICS AND AUTOMATION LETTERS, v.6, no.1, pp.143 - 150, 2021-01 |
| Dark-current suppression in metal-germanium-metal photodetectors through dopant-segregation in NiGe - Schottky barrier Zang, H.; Lee, S. J.; Loh, W. Y.; Wang, J.; Chua, K. T.; Yu, M. B.; Cho, Byung Jin; et al, IEEE ELECTRON DEVICE LETTERS, v.29, no.2, pp.161 - 164, 2008-02 |
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