Browse "College of Engineering(공과대학)" by Type Conference
Showing results 36061 to 36080 of 90872
| High quality bulk heterojunction films formed on a water substrate Lee, Jung-Yong, Global Photovoltaic Conference 2017, Korea Photovoltaic Society, 2017-03-15 |
| High quality bulk heterojunction films formed on an water substrate Noh, Jonghyeon; Jeong, Seonju; Lee, Jung-Yong, GPVC 2017, Korea Photovoltaic Society, 2017-03-16 |
| High Quality Depth Map Upsampling for 3D-TOF Cameras. Park, Jaesik; Kim, Hyeongwoo; Tai, Yu-Wing; Brown, Michael S.; Kweon, In-So, 13th International Conference on Computer Vision (ICCV2011), pp.1623 - 1630, IEEE Computer Society and the Computer Vision Foundation (CVF), 2011-11 |
| High quality graphene synthesis and its application to high performance electronic devices Cho, Byung Jin, The 8th International Conference on Advanced Materials and Devices (ICAMD 2013), The Korean Physical Society, 2013-12-12 |
| High quality Microcrystalline Silicon-Carbide Films Prepared by Photo-CVD Method Using Ethylene Gas as a Carbon source Myong, SY; Lee, HK; Yoon, E; Lim, Koeng Su, MRS Spring Meeting, MRS, 1999-01-01 |
| High Quality Multi-Walled Carbon Nanotubes from Catalytic Decomposition of Carbo Sources Kim, Sang Done, FLUIDIZATION XII, pp.35 - 36, 2007 |
| High Quality N+/P Junction of Ge Substrate Prepared by initiated CVD Doping Process Kim, Jae Hwan; Shin, Sung Won; Lee, Tae In; Hwang, Wan Sik; Cho, Byung-Jin, 2020 IEEE Symposium on VLSI Technology, VLSI Technology 2020, Institute of Electrical and Electronics Engineers Inc., 2020-06-19 |
| High Quality RF Passive Integration using 35 um Thick Oxide Manufacturing Technology Kwon, Young Se, ECTC, pp.1007 - 1011, 2002 |
| High Quality Shape from a Single RGB-D Image under Uncalibrated Natural Illumination Kweon, In-So; Han, Yudeog; Lee, Joon-Young, IEEE International Conference on Computer Vision (ICCV), pp.1617 - 1624, IEEE Computer Society, 2013-12-04 |
| High quality Si1-xGex nanowire and its application to MOSFET integrated with HfO2/TaN/Ta gate stack Cho, Byung Jin; Yang, WF; Lee, SJ; Whang, SJ; Lim, SY; Kwong, DL, 2007 International Conference on Solid State Devices and Materials(SSDM), pp.0 - 0, 2007-09-18 |
| High quality solenoid inductor for Ddielectric Multi-chip Module (D-MCM) Yook J.-M.; Ko J.-H.; Ha M.-L.; Kwon, Young Se, Conference Proceedings- 34th European Microwave Conference, v.3, pp.1365 - 1368, 2004-10-12 |
| High Quality Structure from Small Motion for Rolling Shutter Cameras Im, Sung Hoon; Ha, Hyo Won; Choe, Gyeong Min; Jeon, Hae Gon; Kweon, In So, IEEE International Conference on Computer Vision (ICCV 2015), IEEE Computer Society and the Computer Vision Foundation (CVF), 2015-12-13 |
| High Rate Anaerobic Treatment of Landfill Leachate Shin, Hang-Sik; Lee, Chae-Young; Bae, Byung-Uk; Song, Young-Chae, Proceeding of Korea Solid Wastes Engineering Society, pp.42 - 43, Korea Solid Wastes Engineering Society, 1993 |
| High rate carbon coated LiNi0.5Mn1.5O4 as a positive electrode for Li-ion batteries Nisar, Umair; Jung, Young Hwa; Moon, San; Kim, Do Kyung, 2012년 한국전지학회 추계학술대회, 한국전지학회, 2012-10-19 |
| HIGH RATE DIGESTERS FOR DISTILLERY WASTEWATER Shin, Hang-Sik; Yi, JH; Paik, BC, KOREA SOCIETY OF ENVIRONMENTAL ENGINEERS, 1989 |
| High Recyclable Low-Temperature Adsorbent for CO2 Capture under TSA 최민기, 한국화학공학회 2015년도 학술대회, 한국화학공학회, 2015-11 |
| High reflection tolerance of 1.25-Gb/s RSOA-based WDM PON employing spectrum-sliced ASE source Jeon, H.C.; Cho, K.Y.; Takushima, Y.; Chung, Yun Chur, Optical Transmission, Switching, and Subsystems VI, 2008-10-27 |
| High Refractive Index Polymer (n＞1.9) Synthesized by the Novel Process Using Elemental Sulfur, Termed Sulfur Chemical Vapor Deposition (sCVD) 장원태; 김도흥; 최건우; 임지우; 임성갑, 한국고분자학회 2020년도 추계총회 및 학술대회, 한국고분자학회, 2020-10-08 |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 |
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