A simulation model for thickness profile of the film deposited using planar circular type magnetron sputtering sources

Abstract

The thickness profile of the film deposited by planar circular-type magnetron is simulated considering the relationship between magnetic field profile and target erosion rate. The model is confirmed by the measurement of the film thickness profiles of the Cr films deposited in this study. It is found that the model is applicable to the magnetron sputtering process at low gas pressure. Furthermore, it can be used to predict the thickness profile of the films deposited by magnetron sputtering with various shapes of magnets. (C) 1996 American Vacuum Society.