A simulation model for thickness profile of the film deposited using planar circular type magnetron sputtering sources

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The thickness profile of the film deposited by planar circular-type magnetron is simulated considering the relationship between magnetic field profile and target erosion rate. The model is confirmed by the measurement of the film thickness profiles of the Cr films deposited in this study. It is found that the model is applicable to the magnetron sputtering process at low gas pressure. Furthermore, it can be used to predict the thickness profile of the films deposited by magnetron sputtering with various shapes of magnets. (C) 1996 American Vacuum Society.
Publisher
AMER INST PHYSICS
Issue Date
1996-09
Language
English
Article Type
Article
Citation

JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.14, no.5, pp.2721 - 2727

ISSN
0734-2101
DOI
10.1116/1.580193
URI
http://hdl.handle.net/10203/68883
Appears in Collection
MS-Journal Papers(저널논문)
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