크롬/폴리이미드의 접착력에 미치는 폴리이미드 표면의 플라즈마 처리 효과The effects of plasma treatment of polyimide surface on the adhesion of chromium/polyimide

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Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and 90°peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.
Publisher
한국표면공학회
Issue Date
1993-04
Language
Korean
Citation

한국표면공학회지, v.26, no.2, pp.71 - 81

ISSN
1225-8024
URI
http://hdl.handle.net/10203/67253
Appears in Collection
MS-Journal Papers(저널논문)
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