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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 | |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 | |
| Time delay control of a shape memory alloy actuator Lee, HJ; Lee, Jungju, SMART MATERIALS & STRUCTURES, v.13, no.1, pp.227 - 239, 2004-02 | |
| Theoretical analysis of keyhole dynamics in polarized laser drilling Cho, Jung-Ho; Na, Suck-Joo, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.40, no.24, pp.7638 - 7647, 2007-12 | |
| A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials Lee, Keum-Oh; Hong, Seong-Gu; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.496, no.1-2, pp.471 - 477, 2008-11 | |
| Cure cycle for thick glass/epoxy composite laminates Oh, JH; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.36, no.1, pp.19 - 45, 2002 |
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