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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06
2	Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06

Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09

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