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Results 1-1 of 1 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07

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