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Results 1-10 of 17 (Search time: 0.007 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06

2
Fundamentals of mode III fracture: A discrete dislocation simulation approach

Lee, Soon-Bokresearcher, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2: PT 1: FRACTURE MECHANICS OF MATERIALS; PT 2: BEHAVIOR OF MATERIALS AND STRUCTURE BOOK SERIES: KEY ENGINEERING MATERIALS, v.145-9, pp.144 - 12, 1998

3
An asymptotic analysis of a tensile crack in creeping solids coupled with cumulative damage .1. Small damage region around the crack tip

Lee, Soon-Bokresearcher; Lu, M; Kim, JY, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.34, no.24, pp.3163 - 3178, 1997-08

4
Fatigue of polymer-supported Ag thin films

Sim, Gidongresearcher; Hwangbo, Yun; Kim, Hyun-Ho; Lee, Soon-Bokresearcher; Vlassak, Joost J., SCRIPTA MATERIALIA, v.66, no.11, pp.915 - 918, 2012-06

5
Fatigue and fracture assessment for reliability in electronics packaging

Lee, Soon-Bokresearcher; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03

6
Low-cycle fatigue characteristics of Sn-based solder joints

Lee, KO; Yu, Jinresearcher; Park, TS; Lee, Soon-Bokresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04

7
Dynamic strain aging during low cycle fatigue deformation in prior cold worked 316L stainless steel

Hong, SG; Lee, Soon-Bokresearcher, ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.261-263, pp.1129 - 1134, 2004

8
ANALYSIS ON FAILURES OF PROTECTIVE-OXIDE LAYERS AND CYCLIC OXIDATION

Moon, CO; Lee, Soon-Bokresearcher, OXIDATION OF METALS, v.39, no.1-2, pp.1 - 13, 1993-02

9
Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints

Lee, K. O.; Yu, Jinresearcher; Park, T. S.; Lee, Soon-Bokresearcher, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03

10
Comparison of prediction methods for low-cycle fatigue life of HIP superalloys at elevated temperatures for turbopump reliability

Lee, Keum-Oh; Bae, Keun-Ho; Lee, Soon-Bokresearcher, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.519, no.1-2, pp.112 - 120, 2009-08

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