Search
Results 1-10 of 36 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Computational analysis of metallic nanowire-elastomer nanocomposite based strain sensors Lee, Sangryun; Amjadi, Morteza; Pugno, Nicola; Park, Inkyu; Ryu, Seunghwa, AIP ADVANCES, v.5, no.11, 2015-11 | |
| Three-dimensional Sound Source Localization Using Inter-channel Time Difference Trajectory Lee, Sangmoon; Park, Youngjin; Park, Youn-Sik, INTERNATIONAL JOURNAL OF ADVANCED ROBOTIC SYSTEMS, v.12, 2015-12 | |
| Constructive remodeling of a synthetic endothelial extracellular matrix Han, Sewoon; Shin, Yoojin; Jeong, Hyo Eun; Jeon, Jessie Sungyun; Kamm, Roger D.; Huh, Dongeun; Sohn, Lydia L.; Chung, Seok, SCIENTIFIC REPORTS, v.5, 2015-12 | |
| Dynamic manipulation of particles via transformative optofluidic waveguides Lee, Kang Soo; Lee, Kyung-Heon; Kim, Sang-Bok; Ha, Byung Hang; Jung, Jin Ho; Sung, Hyung Jin; Kim, Sang Soo, SCIENTIFIC REPORTS, v.5, 2015-10 | |
| Nanoscale control of phonon excitations in graphene Kim, Hyo Won; Ko, Wonhee; Ku, JiYeon; Jeon, Insu; Kim, Donggyu; Kwon, Hyeokshin; Oh, Youngtek; Ryu, Seunghwa; Kuk, Young; Hwang, Sung Woo; Suh, Hwansoo, NATURE COMMUNICATIONS, v.6, 2015-06 | |
| Mechanical Failure Mode of Metal Nanowires: Global Deformation versus Local Deformation Duc Tam Ho; Im, Youngtae; Kwon, Soon-Yong; Earmme, Youn Young; Kim, Sung Youb, SCIENTIFIC REPORTS, v.5, 2015-06 | |
| Influence of Tensile Speeds on the Failure Loads of the DP590 Spot Weld under Various Combined Loading Conditions Song, Jung Han; Huh, Hoon, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2015 | |
| Ubiquitous Graphene Electronics on Scotch Tape Chung, Yoonyoung; Kim, Hyun Ho; Lee, Sangryun; Lee, Eunho; Kim, Seong Won; Ryu, Seunghwa; Cho, Kilwon, SCIENTIFIC REPORTS, v.5, 2015-07 | |
| Rotationally reconfigurable metamaterials based on moire phenomenon Han, Jae-Hyung; Kim, Inbo; Ryu, Jung-Wan; Kim, Jungjoon; Cho, Jin-Ho; Yim, Geo-Su; Park, Hyun-Sung; Min, Bumki; Choi, Muhan, OPTICS EXPRESS, v.23, no.13, pp.17443 - 17449, 2015-06 | |
| Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |