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Results 1-10 of 36 (Search time: 0.008 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Computational analysis of metallic nanowire-elastomer nanocomposite based strain sensors

Lee, Sangryun; Amjadi, Morteza; Pugno, Nicola; Park, Inkyuresearcher; Ryu, Seunghwaresearcher, AIP ADVANCES, v.5, no.11, 2015-11

2
Three-dimensional Sound Source Localization Using Inter-channel Time Difference Trajectory

Lee, Sangmoon; Park, Youngjinresearcher; Park, Youn-Sikresearcher, INTERNATIONAL JOURNAL OF ADVANCED ROBOTIC SYSTEMS, v.12, 2015-12

3
Constructive remodeling of a synthetic endothelial extracellular matrix

Han, Sewoon; Shin, Yoojin; Jeong, Hyo Eun; Jeon, Jessie Sungyunresearcher; Kamm, Roger D.; Huh, Dongeun; Sohn, Lydia L.; Chung, Seok, SCIENTIFIC REPORTS, v.5, 2015-12

4
Dynamic manipulation of particles via transformative optofluidic waveguides

Lee, Kang Soo; Lee, Kyung-Heon; Kim, Sang-Bok; Ha, Byung Hang; Jung, Jin Ho; Sung, Hyung Jinresearcher; Kim, Sang Sooresearcher, SCIENTIFIC REPORTS, v.5, 2015-10

5
Nanoscale control of phonon excitations in graphene

Kim, Hyo Won; Ko, Wonhee; Ku, JiYeon; Jeon, Insu; Kim, Donggyu; Kwon, Hyeokshin; Oh, Youngtek; Ryu, Seunghwaresearcher; Kuk, Young; Hwang, Sung Woo; Suh, Hwansoo, NATURE COMMUNICATIONS, v.6, 2015-06

6
Mechanical Failure Mode of Metal Nanowires: Global Deformation versus Local Deformation

Duc Tam Ho; Im, Youngtae; Kwon, Soon-Yong; Earmme, Youn Youngresearcher; Kim, Sung Youb, SCIENTIFIC REPORTS, v.5, 2015-06

7
Influence of Tensile Speeds on the Failure Loads of the DP590 Spot Weld under Various Combined Loading Conditions

Song, Jung Han; Huh, Hoonresearcher, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2015

8
Ubiquitous Graphene Electronics on Scotch Tape

Chung, Yoonyoung; Kim, Hyun Ho; Lee, Sangryun; Lee, Eunho; Kim, Seong Won; Ryu, Seunghwaresearcher; Cho, Kilwon, SCIENTIFIC REPORTS, v.5, 2015-07

9
Rotationally reconfigurable metamaterials based on moire phenomenon

Han, Jae-Hyung; Kim, Inbo; Ryu, Jung-Wan; Kim, Jungjoon; Cho, Jin-Ho; Yim, Geo-Su; Park, Hyun-Sung; Min, Bumkiresearcher; Choi, Muhan, OPTICS EXPRESS, v.23, no.13, pp.17443 - 17449, 2015-06

10
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Sooresearcher, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06

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