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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; Yoo, Seunghyup; Kim, Taek-Soo; Choi, Kyung Cheol; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 | |
| A Sub-Micron-Thick stretchable adhesive layer for the lamination of arbitrary elastomeric substrates with enhanced adhesion stability Jeong, Kihoon; Lee, Yujin; Kim, Youson; Mun, Hyeonwoo; Kyung, Ki-Uk; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.429, pp.132250, 2022-02 |
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