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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Development of the trenchless rehabilitation process for underground pipes based on RTM Chin, WS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.68, no.3, pp.267 - 283, 2005-05 | |
| Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006 | |
| Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01 | |
| Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004 | |
| Non-isothermal in situ dielectric cure monitoring for thermosetting matrix composites Lee, Dai Gil; Kim, HG, JOURNAL OF COMPOSITE MATERIALS, v.38, no.12, pp.977 - 993, 2004 | |
| In situ cure monitoring of adhesively bonded joints by dielectrometry Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003 | |
| Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry Bang, KG; Kwon, JW; Lee, Dai Gil; Lee, JW, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.113, no.1-3, pp.209 - 214, 2001-06 | |
| Repair of underground buried pipes with resin transfer molding Lee, Dai Gil; Chin, WS; Kwon, JW; Yoo, AK, COMPOSITE STRUCTURES, v.57, no.1-4, pp.67 - 77, 2002-07 | |
| Dielectric cure monitoring for glass/polyester prepreg composites Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07 |
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