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Results 1-10 of 387 (Search time: 0.008 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Rapid wavelength-swept spectrally encoded confocal microscopy

Boudoux, C; Yun, SH; Oh, Wang-Yuhlresearcher; White, WM; Iftimia, NV; Shishkov, M; Bouma, BE; Tearney, GJ, OPTICS EXPRESS, v.13, no.20, pp.8214 - 8221, 2005-10

2
대형 압력용기 제작을 위한 9Ni-4Co-0.3C강의 드로잉공정 설계에 관한 연구

홍진태; 이석렬; 김경진; 양동열researcher; 이경훈; 최문선, 한국정밀공학회지, v.22, no.12, pp.93 - 99, 2005-12

3
대형 압력용기의 예비성형체 제작을 위한 공정 설계 및 금형 설계

이석렬; 양동열researcher; 김경진; 홍진태; 이경훈; 최문선, 소성가공, v.14, no.7, pp.613 - 618, 2005-10

4
나노 스테레오리소그래피 공정을 이용한 3차원 극미세 형상제작

양동열researcher; 박상후; 임태우, 한국정밀공학회지, v.22, no.10, pp.17 - 25, 2005-10

5
SOG를 이용한 실리콘과 유리의 저온 접합 공정

유중돈researcher; 이재학, 대한용접접합학회지, v.23, no.6, pp.0 - 0, 2005-12

6
A numerical study of the U-turn bend in return channel systems for multistage centrifugal compressors

Oh, JM; Engeda, A; Chung, Myung Kyoonresearcher, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, v.219, no.8, pp.749 - 756, 2005-08

7
A New Reliability Prediction Method for Flip Chip Packages using Anisotropic Conductive Adhesive (ACA)

, IEEE TRANSACTIONS ON RELIABILITY v. no.0018-9529 , 2005

8
Partially coherent spectral transmittance of dielectric thin films with rough surfaces

Lee, Bong Jaeresearcher; Khuu, VP; Zhang, ZM, JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, v.19, no.3, pp.360 - 366, 2005

9
Modeling radiative properties of silicon with coatings and comparison with reflectance measurements

Lee, Bong Jaeresearcher; Zhang, ZM; Early, EA; DeWitt, DP; Tsai, BK, JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, v.19, no.4, pp.558 - 565, 2005

10
Finite element analysis of Arc-welding process by parallel computation

KIM Juwan; Im, Seyoungresearcher; KIM Hyun-Gyu, YOSETSU GAKKAI RONBUNSHU/QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY , v.23, no.2, pp.203 - 208, 2005-05

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