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Results 31-40 of 209 (Search time: 0.007 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
31
Topology optimization of shell structures using adaptive inner-front (AIF) level set method

Park, KS; Youn, Sung-Kie, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.36, pp.43 - 58, 2008-07

32
Micropeg and hole alignment using image moments based visual servoing method

Wang, Junping; Cho, Hyungsuck, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.55, no.3, pp.1286 - 1294, 2008-03

33
Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures

Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006

34
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry

Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01

35
Characteristics of joining inserts for composite sandwich panels

Kim, Young Jung; Lee, Dai Gil, COMPOSITE STRUCTURES, v.86, no.1-3, pp.55 - 60, 2008-11

36
Impurity effects on the oxy-coal combustion power generation system

Kim, Sungeun; Ahn, Hyungjun; Choi, Sangmin; Kim, Taehyung, INTERNATIONAL JOURNAL OF GREENHOUSE GAS CONTROL, v.11, pp.262 - 270, 2012-11

37
Optimization of a horizontal MOCVD reactor for uniform epitaxial layer growth

Cho, WK; Choi, Do Hyung, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.43, no.10, pp.1851 - 1858, 2000-05

38
Robust Zero Placement for Motion Control of Lightly Damped Systems

Ha, Chang-Wan; Rew, Keun-Ho; Kim, Kyung-Soo, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.60, no.9, pp.3857 - 3864, 2013-09

39
Novel applications of composite structures to robots, machine tools and automobiles

Lee, Dai Gil; Lee, CS; Lee, HG; Hwang, HY; Kim, JW, COMPOSITE STRUCTURES, v.66, no.1-4, pp.17 - 39, 2004-10

40
Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints

Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004

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