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Results 31-40 of 3692 (Search time: 0.008 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
31
Coupling Whispering-Gallery-Mode Microcavities With Modal Coupling Mechanism

Xiao, Yun-Feng; Min, Bumkiresearcher; Jiang, Xiaoshun; Dong, Chun-Hua; Yang, Lan, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.44, no.11-12, pp.1065 - 1070, 2008

32
EHL Analysis of Rolling Bearings Considering the Effect of the Number of Rolling Elements and the Shaft Load

Sung-Ho Hong; Kyung-Woong Kimresearcher, 한국윤활학회지, v.10, no.2011-01-02, pp.17 - 22, 2009

33
금속 샌드위치 판재 대면적 롤 프로젝션 용접에 관한 연구 : Part 1 - 공정 모니터링

안준수; 임지호; 김종화; 나석주researcher, 대한용접·접합학회지, v.27, no.3, pp.85 - 91, 2009-06

34
New approximations of external acoustic-structural interactions: Derivation and evaluation

Lee, Moonseok; Park, Youn-sikresearcher; Park, Youngjinresearcher; Park, K. C., COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, v.198, no.15-16, pp.1368 - 1388, 2009

35
Flow Signal Characteristics of a Small Scale Elctromagnetic Flowmeter in Low Conductivity Fluid Measurement

k.w.lim; Sung, Hyung Jinresearcher, MEASUREMENT, 2006

36
A numerical study of the U-turn bend in return channel systems for multistage centrifugal compressors

Oh, JM; Engeda, A; Chung, Myung Kyoonresearcher, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, v.219, no.8, pp.749 - 756, 2005-08

37
A New Reliability Prediction Method for Flip Chip Packages using Anisotropic Conductive Adhesive (ACA)

, IEEE TRANSACTIONS ON RELIABILITY v. no.0018-9529 , 2005

38
이방성 복합재료 판에서 램파 S0 모드의 군속도 결정

이상호; 이정주researcher; 이정기, 비파괴검사학회지, v.26, no.4, pp.239 - 245, 2006-08

39
복합재료/금속 접착 계면의 파괴인성치 측정

김원석; 이정주researcher, 한국복합재료학회지, v.21, no.4, pp.7 - 14, 2008-08

40
Light scattering of semitransparent sintered polytetrafluoroethylene films

Li, Qinghe; Lee, Bong Jaeresearcher; Zhang, Zhuomin M.; Allen, David W., JOURNAL OF BIOMEDICAL OPTICS, v.13, no.5, 2008

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