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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02 | |
Characterization of the misfit dislocations at the ferrite/cementite interface in pearlitic steel: An atomistic simulation study Kim, Jaemin; Kang, Keonwook; Ryu, Seunghwa, INTERNATIONAL JOURNAL OF PLASTICITY, v.83, pp.302 - 312, 2016-08 |
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