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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005 |
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