Browse "ME-Journal Papers(저널논문)" by Author Song, Jun-Yeob
Showing results 1 to 3 of 3
| A new wafer level TSV build-up stacking using oxide bonding Kim, Sun-Rak; Song, Jun-Yeob; Lee, Seung-Seob; Lee, Jae-Hak, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.6, 2013-06 |
| Design of Highly Uniform Spool and Bar Horns for Ultrasonic Bonding Kim, Sun-Rak; Lee, Jae-Hak; Yoo, Choong-Don; Song, Jun-Yeob; Lee, Seung-Seob, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.58, no.10, pp.2194 - 2201, 2011-10 |
| Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Don; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06 |
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