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Browse "ME-Journal Papers(저널논문)" by Author Earmme, Youn Young

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Showing results 1 to 9 of 9

1	A study on the thermomechanical behavior of semiconductor chips on thin silicon substrate Lim, Jae Hyuk; Han, ManHee; Lee, Jun-Youn; Earmme, Youn Young; Lee, Soon-Bok; Im, Seyoung, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.22, no.8, pp.1483 - 1489, 2008-08
2	An alternating technique for solving subinterface crack problems Choi, SY; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.78, no.3-4, pp.R61 - R69, 1996
3	Analysis of a short interfacial crack from the corner of a rectangular inclusion Pahn, LO; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.106, no.4, pp.341 - 356, 2000-12
4	Anisotropic and isotropic elasticity, and its equivalence for singularity, interface and crack in bimaterials and trimaterials Earmme, Youn Young; Choi, ST; Shin, H, KEY ENGINEERING MATERIALS, v.261-263, pp.23 - 32, 2004
5	Dislocation Dynamics in the Modified Frenkel-Kontorova Model Earmme, Youn Young; weiner, j.h., JOURNAL OF APPLIED PHYSICS, v.48, no.8, pp.3317 - 3331, 1977
6	Elastic singularity interacting with various types of interfaces Choi, ST; Earmme, Youn Young, JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, v.70, no.3, pp.446 - 448, 2003-05
7	Mechanical Failure Mode of Metal Nanowires: Global Deformation versus Local Deformation Duc Tam Ho; Im, Youngtae; Kwon, Soon-Yong; Earmme, Youn Young; Kim, Sung Youb, SCIENTIFIC REPORTS, v.5, 2015-06
8	Stress intensity factors and kink angle of a crack interacting with a circular inclusion under remote mechanical and thermal loadings Lee, Saebom; Choi, Seung Tae; Earmme, Youn Young; Chung, Dae Youl, KSME International Journal, v.17, no.8, pp.1120 - 1132, 2003-08
9	Thermoelastic interaction between a crack and a circular inhomogeneity Chung, DY; Huh, MS; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.111, no.1, pp.L9 - L14, 2001-09

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