Browse "ME-Journal Papers(저널논문)" by Author Yoon, Taeshik
Showing results 1 to 13 of 13
| Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 |
Detection of Graphene Cracks By Electromagnetic Induction, Insensitive to Doping Level Yoon, Taeshik; Kang, Sumin; Kang, Tae Yeob; Kim, Taek-Soo, CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, v.120, no.2, pp.351 - 361, 2019-08 |
| Display process compatible accurate graphene patterning for OLED applications Shin, Jin-Wook; Han, Jun-Han; Cho, Hyunsu; Moon, Jaehyun; Kwon, Byoung-Hwa; Cho, Seungmin; Yoon, Taeshik; et al, 2D Materials, v.5, no.1, 2018-01 |
| Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process Shin, Woo Cheol; Yoon, Taeshik; Mun, Jeong Hun; Kim, Taek Yong; Choi, Sung-Yool; Kim, Taek-Soo; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.103, no.24, 2013-12 |
| Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process Hwang, Jaewon; Yoon, Taeshik; Jin, Sung Hwan; Lee, Jinsup; Kim, Taek-Soo; Hong, Soon-Hyung; Jeon, Seokwoo, ADVANCED MATERIALS, v.25, no.46, pp.6724 - 6729, 2013-12 |
| Flexible and Transparent Graphene Electrode Architecture with Selective Defect Decoration for Organic Light-Emitting Diodes Park, Ick Joon; Kim, Tae In; Yoon, Taeshik; Kang, Sumin; Cho, Hyunsu; Cho, Nam-Sung; Lee, Jeong-Ik; et al, ADVANCED FUNCTIONAL MATERIALS, v.28, no.10, 2018-03 |
| Healing Graphene Defects Using Selective Electrochemical Deposition: Toward Flexible and Stretchable Devices Yoon, Taeshik; Kim, Jae Han; Choi, Jun Hyung; Jung, Dae Yool; Park, Ick Joon; Choi, Sung Yool; Cho, Nam Sung; et al, ACS NANO, v.10, no.1, pp.1539 - 1545, 2016-01 |
| Liquid-assisted adhesion control of graphene-copper interface for damage-free mechanical transfer Kang, Sumin; Yoon, Taeshik; Ma, Boo Soo; Cho, Min Sun; Kim, Taek-Soo, APPLIED SURFACE SCIENCE, v.551, pp.149229, 2021-06 |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
| Prevention of Water Permeation by Strong Adhesion Between Graphene and SiO2 Substrate Jung, Wonsuk; Park, Joonkyu; Yoon, Taeshik; Kim, Taek-Soo; Kim, Soohyun; Han, Chang-Soo, SMALL, v.10, no.9, pp.1704 - 1711, 2014-05 |
| Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes Kang, Sumin; Yoon, Taeshik; Kim, Seunghwan; Kim, Taek-Soo, ACS APPLIED NANO MATERIALS, v.2, no.4, pp.1980 - 1985, 2019-04 |
| Superstrong encapsulated monolayer graphene by the modified anodic bonding Jung, Won Suk; Yoon, Taeshik; Choi, Jongho; Kim, Soohyun; Kim, Yong Hyup; Kim, Taek-Soo; Han, Chang-Soo, NANOSCALE, v.6, no.1, pp.547 - 554, 2014-01 |
| Thermal expansion behavior of thin films expanding freely on water surface Kim, Jae Han; Jang, Kyung-Lim; Ahn, Kwangho; Yoon, Taeshik; Lee, Tae-Ik; Kim, Taek-Soo, SCIENTIFIC REPORTS, v.9, 2019-05 |
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