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Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09 |
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