Showing results 1 to 31 of 31
A Measurement of the Interfacial Fracture Toughness between Chip and Lead frame Earmme, Youn-Young, International Conference on Electronic Materials, 1998 |
A Method of Determination of Crack Growth Resistance Curve by J Integral Earmme, Youn-Young, ROK-ROC Joint Workshop on Fracture of Metals, pp.241 - 255, 1983 |
A problem of anisotropic/isotropic bimaterial with a singularity or under a remote stress Shin H.; Choi S.T.; Earmme, Youn-Young, Thermec 2003 Processing and Manufacturing of Advanced Materials, v.426-432, no.4, pp.3415 - 3420, 2003-07-07 |
A singularity in an anisotropic trimaterial with two parallel interfaces Earmme, Youn-Young, Asian Pacific Conference for Fracture and Strength, 1999 |
An Application of Conservation Integral to Elastic T-stresses of Interface Crack Earmme, Youn-Young, International Conference on Fracture & Strength of Solids, pp.567 - 576, 1997 |
Analysis of a Flat Annular Crack under Skew-Symmetric Loading Earmme, Youn-Young, Joint FEFG/ICF Conf. on Fracture of Engineering Materials and Structures, pp.895 - 900, 1991 |
Analysis of temperature distribution and slip in rapid thermal processing Lee, H; Yoo, YD; Shin, Hyun Dong; Earmme, Youn-Young; Kim CK, Rapid Thermal and Related Processing Techniques, v.1393, pp.404 - 410, 1990-10-02 |
Application of Conservation Integrals to Interfacial Crack Problems Earmme, Youn-Young, 15th Int. Conf. on Structural Mechanics in Reactor Technology, 1999 |
Atomistic simulation of the energy barrier for dislocation movement in Si Kim, S.Y.; Im, Seyoung; Earmme, Youn-Young, The 7th international conference,FEOFS, pp.957 - 962, 123, 2006-11-30 |
Axisymmetric Non-Flat Cracks Earmme, Youn-Young, APCS, pp.1189 - 1194, 1991 |
Conservation Integrals for Cracks in Bi-Material Interface Earmme, Youn-Young, Asian Pacific Congress on Strength, pp.63 - 68, 1986 |
Conservative Interaction Integral Applied to Some Crack Problems Earmme, Youn-Young, Proc. of the 10th Symposium on Fracture and Fracture Mechanics, pp.189 - 193, 1999 |
Crack Tip Opening Displacement as a Fracture Parameter in Creeping Solid, Paper No. 8-3 Earmme, Youn-Young, International Symposium on Pressure Vessel Technology and Nuclear Codes and Standards, 1989 |
Development of Personal Computer Database System of Fatigue Strength Earmme, Youn-Young; Song, Ji Ho, International Conf. ICM, pp.17 - 22, 1991 |
Discontinuity of Stress Intensity Factor for Kinked Interfacial Crack under Anti-Plane Shear Earmme, Youn-Young, KSME/JSME joint conference on Fracture and Strength, pp.502 - 507, 1990 |
Edge Crack in Bonded Quarter Planes under Concentrated Out-of-Plane Loading Earmme, Youn-Young, Asian Pacific Conference on Fracture and Strength, pp.665 - 670, 1993 |
Energy Release Rate for a Kinked/Interfacial Crack Earmme, Youn-Young, Asian Pacific Conference for Fracture and Strength, pp.567 - 571, 1996 |
Energy Release Rate for an Arbitrarily Curved Crack in an Elastic Solid Earmme, Youn-Young, Joint JSME/KSME Conf. "Recent Progress in Fracture Mechanices", pp.105 - 108, 1993 |
Evaluation of elastic T-stress using a conservation integral Earmme, Youn-Young, Pan-Pacific Conf. on Computational Engineering, pp.43 - 48, 1993 |
Experimental Determination of Thin Film Adhesion Using 4 Point Bending Specimen Earmme, Youn-Young, Third International Symposium on Electronics Materials and Packaging 2001, pp.376 - 381, Third International Symposium on Electronics Materials and Packaging 2001, 2001-11 |
Integrity Analysis of Solder Joints: Fracture Mechanics Approach Earmme, Youn-Young, Third International Symposium on Electronics Materials and Packaging,2001, pp.404 - 411, 2001 |
Measurement of mechanical properties and residual stresses of bridged gold films and circular gold membranes Choi W.S.; Choi S.T.; Son S.U.; Lee S.S.; Yang S.Y.; Earmme, Youn-Young, v.326-328 I, pp.227 - 232, 2006 |
Measurement of time-dependent adhesion between PDMS film and flat indenter tip Earmme, Youn-Young, 3rd International Indentation Workshop,Cavendish Lab, 2007 |
Measurement of Young's Modulus and Residual Stress in E-Beam Evaporated Aluminum and Thermally Evaporated Chromium Films using Blister Method Moon, HJ; Earmme, Youn-Young; Park, SS; Cho, Young-Ho, Proc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, pp.5 - 6, 1996-06-10 |
New Approach for the Modeling and Simulation of Simple Cracked Rotor Jun, O.S.; Lee, Chong-Won; Earmme, Youn-Young; Eun, H.J., The Fourth International Symposium on Transport Phenomena and Dynamics of Rotating Machinery, pp.351 - 360, 1992-04 |
Salvage Procedures in Failed Hip Arthroplasties Kwak, Byung Man; Earmme, Youn-Young, first Pacific Area Conference on Orthopedics and Biomechanics, pp.99 - 104, 1984-08-01 |
Salvage Procedures in Failed Total Hip Relacement Earmme, Youn-Young, The Hip-Clinical Studies and Basic Research, pp.321 - 324, 1984-08-01 |
Thermoelastic analysis of an interfacial crack in bimaterial Kim T.W.; Im S.; Earmme, Youn-Young, Proceedings of the KSME/JSME Joint Conference, pp.403 - 408, 1990-07-06 |
Thermoelastic Analysis of an Interfacial Crack in Bimaterials Kim,T.W.; Im, Seyoung; Earmme, Youn-Young, KSME/JSME joint conference on Fracture and Strength, v.0, no.0, pp.514 - 519, 1990-08 |
Thermomechanical Stress Analysis of Multilayer PCBs Consisting of Metals and Viscoelastic Polymers Earmme, Youn-Young, International Conference on Fracture & Strength of Solids, 2000 |
Vapor Pressure Analysis of Popcorn Cracking in Plastic IC Packages by Fracture Mechanics Earmme, Youn-Young, Electronics Packaging Technology Conference (EPTC), pp.36 - 42, EPTC, 1998-12 |
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