급속 열처리시 실리콘 웨이퍼의 온도 분포와 슬립 현상의 해석Analysis of Temperature Distribution and slip in Rapid Thermal Processing
- Publisher
- 대한기계학회
- Issue Date
- 1992-04
- Language
- Korean
- Citation
대한기계학회논문집 A, v.16, no.4, pp.609 - 620
- ISSN
- 1226-4873
- Appears in Collection
- Files in This Item
- There are no files associated with this item.
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