Lee, Wonmi; Lee, Juho; Yu, Taegyun; Kim, Hyeong-Jong; Kim, Min Kyung; Jang, Sungbin; Kim, Juhee; Han, Yu-Jin; Choi, Sunghun; Choi, Sinho; Kim, Tae-Hee; Park, Sang-Hoon; Jin, Wooyoung; Song, Gyujin; Seo, Dong-Hwa; Jung, Sung-Kyun; Kim, Jinsoo, Nature Communications, v.15, no.1, 2024-12
노현빈; Han, Jeongho; Ryou, KenHee; Choi, Pyuck-Pa, SCRIPTA MATERIALIA, v.253, 2024-12
Kim, Ki Jeong; Song, Sang Yoon; Lee, Gunjick; Kim, Hye-Jin; Um, Ho Yong; Hyun, Joo-Sik; Jung, Seung-Pill; Ryou, KenHee; Choi, Pyuck-Pa; Zargaran, Alireza; Lee, Myoung-Gyu; Sohn, Seok Su, MATERIALS SCIENCE AND ENGINEERING, v.913, 2024-10
Moorthy, Megala; Thangavel, Ranjith; Krishnan Ganesan, Bala; Saha, Aditi; Hong, Seungbum; Lee, Yun-Sung, Chemical Engineering Journal, v.498, pp.155234, 2024-10
EOM, SEONGMUN; Kavle, Pravin; Kang, Deokyoung; Kim, Yeon-gyu; Martin, Lane W.; HONG, DANIEL SEUNGBUM, Advanced Functional Materials, 2024-09
Kim, Gwangmin; In, Jae Hyun; Lee, Younghyun; Rhee, Hakseung; Park, Woojoon; Song, Hanchan; Park, Juseong; Jeon, Jae Bum; Brown, Timothy D.; Talin, A. Alec; Kumar, Suhas; Kim, Kyung Min, NATURE MATERIALS, v.23, no.9, 2024-09
Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
Ippili, Swathi; Kumar, Gobbilla Sai; Sharma, Arti; Ko, Yoonah; Hong, Seungbum; Goddati, Mahendra; Saini, Haneesh; Lee, Jaebeom; Yang, Tae‐Youl; Siddhanta, Soumik; Jella, Venkatraju; Yoon, Soon‐Gil; Jayaramulu, Kolleboyina, Advanced Energy Materials, 2024-08
Jang, Jinhyeong; Joo, Soyun; Yeom, Jiwon; Jo, Yonghan; Zhang, Jingshu; Hong, Seungbum; Park, Chan Beum, ADVANCED SCIENCE, 2024-08
Estimation of order-disorder transition temperature in Pt-Co alloy by Monte Carlo simulation using modified embedded atom method Park, SI; Lee, BJ; Lee, HyuckMo, SCRIPTA MATERIALIA, v.45, no.5, pp.495 - 502, 2001 |
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01 |
Microstructural Observation on Effect of Oxidation Method of AlOx in Magnetic Tunnel Junction by HRTEM Lee, Hyuck Mo; Bae, Jun Soo; Shin, Kyung Ho, J. Appl. Phys., vol. 91, no. 10, pp. 7947-7949, 2002-05 |
Effect of sputtering condition and heat treatment in Co/Cu/Co/FeMn spin valve Kim, HJ; Bae, JS; Lee, Taek Dong; Lee, HyuckMo, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.241, no.2-3, pp.173 - 178, 2002-03 |
A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998 |
Calculation of surface tension and wetting properties of Sn-based solder alloys Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302, 1999-01 |
Phase equilibrium of the Ti-Cr-V ternary system in the non-burning β-Ti alloy region Lee, Jeong Yub; Kim, Jong Hoon; Park, Seong Il; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.291, no.1-2, pp.229 - 238, 1999 |
Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
Magnetic tunnel junctions with high magnetoresistance and small bias voltage dependence using epitaxial NiFe(111) ferromagnetic bottom electrodes Yu, JH; Lee, HyuckMo; Hayashi, M; Oogane, M; Daibou, T; Nakamura, H; Kubota, H; et al, JOURNAL OF APPLIED PHYSICS, v.93, no.10, pp.8555 - 8557, 2003-05 |
Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
Morphological characteristics of multi-layer/substrate systems Wolczynski, Waldemar; Guzik, Edward; Janczak-Rusch, Jolanta; Kopycinski, Dariusz; Golczewski, Jerzy; Lee, HyuckMo; Kloch, Jacenty, MATERIALS CHARACTERIZATION, v.56, no.4-5, pp.274 - 280, 2006-06 |
Finite-element method study for the spin-polarized transport in a hybrid spin valve Noh, Eun Sun; Ulloa, Sergio E.; Lee, HyuckMo, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.310, no.2, pp.1889 - 1891, 2007-03 |
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo; Choi, Won Kyoung, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.11, pp.1975 - 1981, 2006-11 |
Preferential segregation of Pd atoms in the Ag-Pd bimetallic cluster: Density functional theory and molecular dynamics simulation Kim, Hyun-You; Kim, Hyoung-Gyu; Ryu, Ji-Hoon; Lee, Hyuck-Mo, PHYSICAL REVIEW B, v.75, no.21, pp.212105-1 - 212105-4, 2007-06 |
Investigation of link formation in a novel planar-type antifuse structure Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Ilyung, Thin Solid Films, 288, 41-44, 1996-02-20 |
A characterization of the thermal parameters of thermally driven polysilicon microbridge actuators using electrical impedance analysis Lee, Jae-Youl; Kang, Sang-Won, SENSORS AND ACTUATORS A-PHYSICAL, v.75, no.1, pp.86 - 92, 1998-11 |
Theoretical evaluation of film growth rate during atomic layer epitaxy Park, Hyung-Sang; Min, Jae-Sik; Lim, Jung-Wook; Kang, Sang-Won, APPLIED SURFACE SCIENCE, v.158, no.1-2, pp.81 - 91, 1999-12 |
THE EFFECT OF AMORPHOUS-SILICON CAPPING ON TITANIUM DURING TISI2 FORMATION BY RTA Kang, Sang-Won; Park, Sin Chong; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.25, no.1A, pp.98 - 102, 1990-01 |
STRUCTURAL AND OPTICAL-PROPERTIES OF MICROCRYSTALLINE SILICON FILMS DEPOSITED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION Moon, DG; Jung, BH; Lee, JN; Ahn, Byung Tae; Lim, Ho Bin; Nam, KS; Kang, SW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.5, no.6, pp.364 - 369, 1994 |
Investigation of link formation in a novel planar-type antifuse structure Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Hyung-Joun, Thin Solid Films 288 (1996) 41--44, 1996-02 |
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