MS-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 7141 to 7160 of 7317

7141
Estimation of order-disorder transition temperature in Pt-Co alloy by Monte Carlo simulation using modified embedded atom method

Park, SI; Lee, BJ; Lee, HyuckMo, SCRIPTA MATERIALIA, v.45, no.5, pp.495 - 502, 2001

7142
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, WK; Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.1, pp.43 - 51, 2002-01

7143
Microstructural Observation on Effect of Oxidation Method of AlOx in Magnetic Tunnel Junction by HRTEM

Lee, Hyuck Mo; Bae, Jun Soo; Shin, Kyung Ho, J. Appl. Phys., vol. 91, no. 10, pp. 7947-7949, 2002-05

7144
Effect of sputtering condition and heat treatment in Co/Cu/Co/FeMn spin valve

Kim, HJ; Bae, JS; Lee, Taek Dong; Lee, HyuckMo, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.241, no.2-3, pp.173 - 178, 2002-03

7145
A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system

Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998

7146
Calculation of surface tension and wetting properties of Sn-based solder alloys

Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302, 1999-01

7147
Phase equilibrium of the Ti-Cr-V ternary system in the non-burning β-Ti alloy region

Lee, Jeong Yub; Kim, Jong Hoon; Park, Seong Il; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.291, no.1-2, pp.229 - 238, 1999

7148
Thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003

7149
Magnetic tunnel junctions with high magnetoresistance and small bias voltage dependence using epitaxial NiFe(111) ferromagnetic bottom electrodes

Yu, JH; Lee, HyuckMo; Hayashi, M; Oogane, M; Daibou, T; Nakamura, H; Kubota, H; et al, JOURNAL OF APPLIED PHYSICS, v.93, no.10, pp.8555 - 8557, 2003-05

7150
Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01

7151
Morphological characteristics of multi-layer/substrate systems

Wolczynski, Waldemar; Guzik, Edward; Janczak-Rusch, Jolanta; Kopycinski, Dariusz; Golczewski, Jerzy; Lee, HyuckMo; Kloch, Jacenty, MATERIALS CHARACTERIZATION, v.56, no.4-5, pp.274 - 280, 2006-06

7152
Finite-element method study for the spin-polarized transport in a hybrid spin valve

Noh, Eun Sun; Ulloa, Sergio E.; Lee, HyuckMo, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.310, no.2, pp.1889 - 1891, 2007-03

7153
Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo; Choi, Won Kyoung, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.11, pp.1975 - 1981, 2006-11

7154
Preferential segregation of Pd atoms in the Ag-Pd bimetallic cluster: Density functional theory and molecular dynamics simulation

Kim, Hyun-You; Kim, Hyoung-Gyu; Ryu, Ji-Hoon; Lee, Hyuck-Mo, PHYSICAL REVIEW B, v.75, no.21, pp.212105-1 - 212105-4, 2007-06

7155
Investigation of link formation in a novel planar-type antifuse structure

Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Ilyung, Thin Solid Films, 288, 41-44, 1996-02-20

7156
A characterization of the thermal parameters of thermally driven polysilicon microbridge actuators using electrical impedance analysis

Lee, Jae-Youl; Kang, Sang-Won, SENSORS AND ACTUATORS A-PHYSICAL, v.75, no.1, pp.86 - 92, 1998-11

7157
Theoretical evaluation of film growth rate during atomic layer epitaxy

Park, Hyung-Sang; Min, Jae-Sik; Lim, Jung-Wook; Kang, Sang-Won, APPLIED SURFACE SCIENCE, v.158, no.1-2, pp.81 - 91, 1999-12

7158
THE EFFECT OF AMORPHOUS-SILICON CAPPING ON TITANIUM DURING TISI2 FORMATION BY RTA

Kang, Sang-Won; Park, Sin Chong; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.25, no.1A, pp.98 - 102, 1990-01

7159
STRUCTURAL AND OPTICAL-PROPERTIES OF MICROCRYSTALLINE SILICON FILMS DEPOSITED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

Moon, DG; Jung, BH; Lee, JN; Ahn, Byung Tae; Lim, Ho Bin; Nam, KS; Kang, SW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.5, no.6, pp.364 - 369, 1994

7160
Investigation of link formation in a novel planar-type antifuse structure

Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Hyung-Joun, Thin Solid Films 288 (1996) 41--44, 1996-02

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