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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Ll2 (Al, Cr)3 Ti기 2상 금속간화합물의 소성거동에 미치는 V 및 Zr 첨가의 효과 박정용; 오명훈; 위당문, 대한금속·재료학회지 , v.36, no.7, pp.1062 - 1068, 1998-01 | |
| Determination of the linear electrooptic coefficient of a lead zirconate titanate thin film using two-beam polarization interferometer with an adaptive photodetector Spirin, VV; Lee, C; No, Kwangsoo; Sokolov, IA, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.37, no.5A, pp.519 - 521, 1998-05 | |
| Microstructure and electric properties of the PZT thin films fabricated by ECR PECVD: the effects of an interfacial layer and rapid thermal annealing Chung, Su Ock; Kim, Jae Whan; Kim, Sung Tae; Kim, Geun Hong; Lee, Won-Jong, MATERIALS CHEMISTRY AND PHYSICS, v.53, no.1, pp.60 - 66, 1998 | |
| Structural properties and interfacial layer formation of Pd films grown on InP substrates Kim, TW; Yoon, YS; Lee, JeongYong; Shin, YD; Yoo, KH; Kim, CO, APPLIED SURFACE SCIENCE, v.136, no.1-2, pp.117 - 122, 1998-10 | |
| Pt 상부 전극 증착온도가 PZR 박막의 전지적 특성에 미치는 영향 이강운; 이원종, 한국재료학회지, v.8, no.11, pp.1048 - 1054, 1998-04 | |
| The role and mechanism of a ZnTe buffer layer on the structural properties of the strained CdxZn1-xTe/ZnTe double quantum wells Kim, TW; Lee, DU; Lim, YS; Lee, JeongYong; Park, HL, SOLID STATE COMMUNICATIONS, v.106, no.3, pp.153 - 156, 1998-04 | |
| Electrical properties of the perovskite (Pb, La)TiO3 films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition Chung, SW; Kim, YI; Park, HL; Lee, Won-Jong, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.9, no.5, pp.383 - 390, 1998-10 | |
| Process and characterization of (Pb, La)TiO3 thin films deposited by MOCVD for gigabit DRAM application Lee, SS; Kang, YM; Lee, J; Lee, DH; Kim, Ho Gi, JOURNAL DE PHYSIQUE IV, v.8, no.p9, pp.269, 1998-12 | |
| Design and understanding of Anisotropic Conductive Films (ACFs) for LCD packaging Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.21, no.2, pp.226 - 234, 1998-06 | |
| 라미네이션 공정으로 제조된 멀티칩 모듈 기판에서의 열적-기계적 응력 해석 김진수; 백경욱; 오승환; 서현식, 대한금속학회지, v.36, no.1, pp.27 - 32, 1998-01 |
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