Browse "MS-Journal Papers(저널논문)" by Title
Showing results 241 to 260 of 7194
| A study on the residual stress measurement methods on chemical vapor deposition diamond films Kim, JG; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.13, no.11, pp.3027 - 3033, 1998-11 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; Cao, Yang; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05 |
| A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01 |
| A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Hyun, JG; Cho, SD; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1264 - 1269, 2005-09 |
| A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12 |
| A study on the Vacuum Casting of Poly-Si wafer 이근희; 이진형, 한국주조공학회지, v.20, no.3, pp.188 - 196, 2000-06 |
| A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06 |
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| A study on tunneling magnetoresistance in magnetic tunnel junctions oxidized by ozone Park, Byong Guk; Lee, Taek Dong, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.226, no.SI, pp.926 - 929, 2001-05 |
| A study on VMn underlayer in CoCrPt longitudinal media Se Chung Oh; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.37, no.4, pp.1504 - 1507, 2001 |
| A synthetic amyloid lawn system for high-throughput analysis of amyloid toxicity and drug screening Girigoswami, Koyeli; Ku, Sook Hee; Ryu, Jungki; Park, Chan Beum, BIOMATERIALS, v.29, no.18, pp.2813 - 2819, 2008 |
| A tailored oxide interface creates dense Pt single-atom catalysts with high catalytic activity Yoo, Mi; Yu, Young-Sang; Ha, Hyunwoo; Lee, Siwon; Choi, Jin-Seok; Oh, Sunyoung; Kang, Eunji; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.13, no.4, pp.1231 - 1239, 2020-04 |
| A terahertz metamaterial with unnaturally high refractive index Choi, Mu-Han; Lee, Seung-Hoon; Kim, Yu-Shin; Kang, Seung-Beom; Shin, Jong-Hwa; Kwak, Min-Hwan; Kang, Kwang-Young; et al, NATURE, v.470, no.7334, pp.366 - 371, 2011-02 |
| A theoretical study of a spin polarized transport and giant magnetoresistance: The effect of the number of layers in a magnetic multilayer Noh, Eun Sun; Lee, HyuckMo; Lee, Seung-Cheol; Ulloa, Sergio E., JOURNAL OF APPLIED PHYSICS, v.103, no.8, pp.083903-1 - 083903-8, 2008-04 |
| A theoretical study of an amorphous aluminium oxide layer used as a tunnel barrier in a magnetic tunnel junction Noh, E. S.; Ulloa, S. E.; Lee, HyuckMo, PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, v.244, no.12, pp.4427 - 4430, 2007-12 |
| A theoretical study of the effect of electronic structures of ferromagnets on giant magnetoresistance Noh, ES; Lee, HyuckMo; Ulloa, SE, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.48, no.3, pp.451 - 459, 2006-03 |
| A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.6, pp.557 - 563, 2002 |
| A thermodynamic study of phase equilibria in the Sn-Bi-Pb solder system Yoon, SW; Lee, HyuckMo, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.22, no.2, pp.167 - 178, 1998 |
| A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer Lim, JH; Kim, JS; Paik, Kyung-Wook; Earmme, Youn-Young, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000 |
| A thickness modulation effect of HfO2 interfacial layer between double-stacked Ag nanocrystals for nonvolatile memory device applications Ryu, Seong-Wan; Choi, Yang-Kyu; Bin Mo, Chan; Hong, Soon-Hyung; Park, Pan Kwi; Kang, Sang-Won, JOURNAL OF APPLIED PHYSICS, v.101, no.2, pp.43 - 46, 2007-01 |
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