Showing results 4141 to 4160 of 7245
Mechanical behavior of carbon/phenolic ablative composites for nozzle application Kim, PW; Hong, Soon-Hyung; Kim, YC; Yeh, BH; Won, YG, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.1153 - 1158, 2000-01 |
Mechanical properties and structural stability of perovskite-type, oxygen-permeable, dense membranes Lee, S; Woo, SK; Lee, KS; Kim, Do Kyung, DESALINATION, v.193, pp.236 - 243, 2006-05 |
Mechanical Properties and Thermal Stability of CrSiN/AlN Multilayer Coatings Using a Closed-Field Unbalanced Magnetron Sputtering System Kim, Sung-Min; Kim, Gwang-Seok; Lee, Sang-Yul; Lee, Jae-Wook; Lee, JeongYong; Lee, Bo-Young, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.54, pp.1109 - 1114, 2009-03 |
Mechanical Properties of 2-D Silica-Silica Continuous Fiber-reinforced Ceramic-matrix Composite Fabricated by Sol-Gel Infiltration Kim, Ha Neul; Kim, Dong Jun; Kang, Eul Son; Kim, Do Kyung, KOREAN JOURNAL OF MATERIALS RESEARCH, v.19, no.7, pp.391 - 396, 2009-07 |
Mechanical properties of C-SiC composite materials fabricated by the Si-Cr alloy melt-infiltration method Kim, Seyoung; Han, In Sub; Seong, Young-Hoon; Kim, Do Kyung, JOURNAL OF COMPOSITE MATERIALS, v.49, no.24, pp.3057 - 3066, 2015-10 |
Mechanical Properties of Chemical-Vapor-Deposited Silicon Carbide using a Nanoindentation Technique 김정호; 이현근; 박지연; 김원주; 김도경, 한국세라믹학회지, v.45, no.9, pp.518 - 523, 2008-09 |
Mechanical Properties of Directionally Arrayed Dendrites in the Ni3Al Matrix lu, y.; Je Hyun Lee; jang, y.h.; kim, s.s.; Myung Hoon Oh; Wee, Dang-Moon, ADVANCED MATERIALS RESEARCH, v.29-30, no.0, pp.71 - 74, 2007-11 |
Mechanical properties of electrochemically lithiated Sn Hong, Chung Su; Han, Seung Min, EXTREME MECHANICS LETTERS, v.40, 2020-10 |
Mechanical properties of Si- and C-doped directionally solidified TiAl-Nb alloys Kim, SW; Wang, P; Oh, MH; Wee, Dang-Moon; Kumar, KS, INTERMETALLICS, v.12, no.5, pp.499 - 509, 2004-05 |
Mechanical properties of WC–10Co cemented carbides sintered from nanocrystalline spray conversion processed powders Cha, SI; Kim, BK; Hong, Soon-Hyung, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.19, no.6, pp.397 - 403, 2001 |
Mechanical reliability and bump degradation of ACF flip chip packages using BCB (Cyclotene (TM)) bumping dielectrics under temperature cycling Kwon, WS; Kim, HJ; Paik, Kyung-Wook; Jang, SY; Hong, SM, JOURNAL OF ELECTRONIC PACKAGING, v.126, no.2, pp.202 - 207, 2004-06 |
Mechanical Removal and Rescreening of Local Screening Charges at Ferroelectric Surfaces Tong, Sheng; Park, Woon Ik; Choi, Yoon-Young; Stan, Liliana; Hong, Seungbum; Roelofs, Andreas, PHYSICAL REVIEW APPLIED, v.3, no.1, 2015-01 |
MECHANICAL-PROPERTIES OF MICA GLASS-CERAMICS Baik, DS; No, Kwangsoo; Chun , Soung Soon, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.78, no.5, pp.1217 - 1222, 1995-05 |
Mechanically improved sol-gel derived methacrylate-siloxane hybrid materials with urethane linkage Kim, Yun Hyeok; Choi, Gwang-Mun; Kim, Yong Ho; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.89, no.1, pp.111 - 119, 2019-01 |
Mechanism and nanosize products of the sol-gel reaction using diphenylsilanediol and 3-methacryloxypropyltrimethoxysilane as precursors Kim, SY; Augustine, S; Eo, YJ; Bae, Byeong-Soo; Woo, Seong-Ihl; Kang, Jeung Ku, JOURNAL OF PHYSICAL CHEMISTRY B, v.109, no.19, pp.9397 - 9403, 2005-05 |
Mechanism for controlling the shape of Cu nanocrystals prepared by the polyol process Cha, SI; Mo, CB; Kim, KT; Jeong, YJ; Hong, Soon-Hyung, JOURNAL OF MATERIALS RESEARCH, v.21, pp.2371 - 2378, 2006-09 |
Mechanism for strong yellow emission of Y3Al5O12 : Ce3+ phosphor under electron irradiation for the application to field emission backlight units Jang, Ho Seong; Kang, Jong Hyuk; Won, Yu-Ho; Lee, Sora; Jeon, DukYoung, APPLIED PHYSICS LETTERS, v.90, no.7, pp.2800 - 2804, 2007-02 |
Mechanism of abnormal grain growth in ultrafine-grained nickel Jung, Sang-Hyun; Yoon, Duk Yong; Kang, Suk-Joong L, ACTA MATERIALIA, v.61, no.15, pp.5685 - 5693, 2013-09 |
Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
Mechanism of enhanced crystallization of amorphous Si thin films by microwave annealing Ahn, JH; Ahn, Byung Tae, ELECTRONIC MATERIALS LETTERS, v.3, no.2, pp.69 - 74, 2007-06 |
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