Browse "MS-Journal Papers(저널논문)" by Title
Showing results 201 to 220 of 7317
| A study on boundary conditions of piston thermal loading analysis in internal combuston engines D.S.chung; Y.S.Cho; H.O.Choi; Z.H.Lee, 대한기계학회논문집, v.12, no.3, pp.528 - 532, 1988 |
| A study on cathode structure and water transport in air-breathing PEM fuel cells Jeong, Seong Uk; Cho, Eun Ae; Kim, Hyoung-Jhun; Lim, Tae-Hoon; Oh, In-Hwan; Kim, Sung Hyun, JOURNAL OF POWER SOURCES, v.159, no.2, pp.1089 - 1094, 2006-09 |
| A study on cobalt substitution in sodium manganese mixed-anion phosphates as positive electrode materials for Na-ion batteries Ryu, Soojy; Wang, Ji Eun; Kim, Joo-Hyung; Ruffo, Riccardo; Jung, Young Hwa; Kim, Do Kyung, JOURNAL OF POWER SOURCES, v.444, pp.227274, 2019-12 |
| A study on coining processes of solder bumps on organic substrates Nah, JW; Paik, Kyung-Wook; Hwang, TK; Kim, WH, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.26, pp.166 - 172, 2003-04 |
| A study on correlation of low voltage cathodoluminescent properties with electrical conductivity of In2O3-coated ZnGa2O4 : Mn phosphors Kim, JY; Jeon, DukYoung; Yu, I; Yang, HG, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.9, pp.3559 - 3563, 2000-09 |
| A study on dielectric constants of epoxy/SrTiO3 composite for embedded capacitor films (ECFs) Lee, Sangyong; Hyun, Jin-Gul; Kim, Hyungsoo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.3, pp.428 - 433, 2007-08 |
| A Study on Dislocation Mechanisms of Toughening in Cu-Graphene Nanolayered Composite Lee, Subin; Ghaffarian, Hadi; Kim, Wonsik; Lee, Taegu; Han, Seung Min; Ryu, Seunghwa; Oh, Sang Ho, NANO LETTERS, v.22, no.1, pp.188 - 195, 2022-01 |
| A study on Electronic Properties of Passive Film Formed on Ti Kim, Dong-Yung; Kwon, Hyuk-Sang, CORROSION SCIENCE AND TECHNOLOGY, v.2, no.5, pp.212 - 218, 2003-10 |
| A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08 |
| A study on hydrogen generation from NaBH4 solution using the high-performance Co-B catalyst Jeong, SU; Kim, RK; Cho, EunAe; Kim, HJ; Nam, SW; Oh, IH; Hong, SA; et al, JOURNAL OF POWER SOURCES, v.144, no.1, pp.129 - 134, 2005-06 |
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| A study on intergranular corrosion of laser treated alloy 600 by DL-EPR method and microscopic examination Lim, YS; Kim, HP; Kim, JS; Kwon, Hyuk-Sang, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.595 - 600, 2000 |
| A Study on Metastable Pitting of Alloy 690 in chloride solutions at 90℃ Bai, Zhi Jun; Kwon, Hyuk Sang, CORROSION SCIENCE AND TECHNOLOGY, v.31, no.1, pp.34 - 40, 2002 |
| A study on pitting corrosion of TiN-coated Inconel 600 by immersion test in high temperature chloride solutions Kim, YI; Chung, HS; Kim, WW; Kim, JS; Lee, Won-Jong, SURFACE COATINGS TECHNOLOGY, v.80, no.1-2, pp.113 - 116, 1996-03 |
| A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03 |
| A Study on solidification of silicon by floating technique g.h.lee; z.h.lee, 한국결정성장학회지, v.10, no.1, pp.30 - 45, 2000 |
| A study on surface treatment of Nafion membrane and its effects on cell performance Prasanna, M.; Cho, EunAe; Kim, H.-J.; Lim, T.-H.; Oh, I.-H., Studies in Surface Science and Catalysis, v.159, pp.605 - 608, 2006 |
| A study on the 50 μm fine pitch Flex-on-Flex (FOF) assembly using conventional and nanofiber anisotropic conductive films (ACFs) Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.35, no.8, 2024-03 |
| A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
| A Study on the Aging of CuxNi2/3Mn(7/3-x)O4 Thermistors Synthesized by Solid State Reaction 김호기; 장규철; 한이섭; 양광성; 이충국, JOURNAL OF KOREAN INSTITUTE OF ELECTRICAL AND ELECTRONIC MATERIAL ENGINEERS, v.12, no.12, pp.1152 - 1163, 1999 |
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