Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
Kim, Wonsik; Kim, Sang Min; Han, Seung Min, SCRIPTA MATERIALIA, v.241, 2024-03
Zhang, Wen; Li, Kunxuan; Chen, Lei; Shi, Zhan; Huo, Sijia; Wei, Boxin; Kang, Suk-Joong L.; Wang, Yujin; Zhou, Yu, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.44, no.3, pp.1396 - 1403, 2024-03
Kwon, Kyungmin; RYU, SEUNG HWAN; Joo, Soyun; HONG, DANIEL SEUNGBUM; Han, Youngjoon; Baek, Donghyeon; Park, Moonsoo; Kim, Dongwon, APL Materials, v.12, no.3, 2024-03
Lee, Sangpyo; Kim, Youngkyung; Park, Chanhyun; Kim, Jihye; Kim, Jae-Seung; Jo, Hyoi; Lee, Chang Ju; Choi, Sinho; Seo, Dong-Hwa; Jung, Sung-Kyun, ACS Energy Letters, pp.1369 - 1380, 2024-03
An, Jaehun; Park, Hyewon; Jung, Young Hoon; Min, Seongwook; Kim, Dong Hyun; Joe, Daniel J.; Lee, Sang-Goo; Hyeon, Dong Yeol; Je, Yub; Seo, Hee-Seon; Jeong, Uichang; Hong, Seungbum; Hwang, Geon-Tae; Joung, Boyoung; Lee, Keon Jae, NANO ENERGY, v.121, 2024-03
Yun, Seokjung; HONG, DANIEL SEUNGBUM; Kim, Hoon; Kang, Min-Ho; Kim, Taeho; Cho, Seongwoo; Park, Ming Hyuk; Jeon, Sanghun; Choi, Yang-Kyu, ACS Applied Electronic Materials, 2024-03
Choi, Jungwoo; Yoo, Jaeyoung; Kang, Ku; Lee, Hyuck Mo, MATERIALS CHEMISTRY AND PHYSICS, v.313, 2024-02
Yang, Geon Gug; Choi, Hee Jae; Li, Sheng; Kim, Jang Hwan; Kwon, Kyeongha; Jin, Hyeong Min; Kim, Bong Hoon; Kim, Sang Ouk, Nature Reviews Electrical Engineering, 2024-02
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, Advanced Science, 2024-02
The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
Advances in Perovskite Oxides for Chemiresistive Sensors Baek, Jong Won; Kim, Il-Doo, ACCOUNTS OF MATERIALS RESEARCH, v.4, no.12, pp.1108 - 1120, 2023-12 |
To elucidate the effect of alloying elements for enhanced nitriding of aluminum: A multiscale computational study Choi, Jungwoo; Yoo, Jaeyoung; Kang, Ku; Lee, Hyuck Mo, MATERIALS CHEMISTRY AND PHYSICS, v.313, 2024-02 |
시효 처리에 의한 42Sn-58Bi 솔더와 무전해 Ni-P/치환 Au UBM간의 계면 반응 조문기; 이혁모; 부성운; 김태규, 마이크로전자 및 패키징학회지, v.12, no.2, pp.95 - 103, 2005-06 |
A conformable microneedle sensor with photopatternable skin adhesive and gel electrolyte for continuous glucose monitoring Kang, Joohyuk; Kim, Kyung Yeun; Kim, Seungwan; Hong, Hyejun; Bae, Byeong-Soo; Kang, Seung-Kyun; Lee, Wonryung, Device, v.1, no.4, 2023-10 |
Flash-Thermal Shock Synthesis of Single Atoms in Ambient Air Kim, Dong-Ha; Cha, Jun-Hwe; Chong, Sanggyu; Cho, Su-Ho; Shin, Hamin; Ahn, Jaewan; Jeon, Dogyeong; et al, ACS NANO, v.17, no.23, pp.23347 - 23358, 2023-10 |
Integration of Large-Area Halide Perovskite Single Crystals and Substrates via Chemical Welding Using an Ionic Liquid for Applications in X-ray Detection Kim, Min Kyu; Choi, Young Seung; Kim, Dooho; Heo, Kang; Oh, Seung Jin; Lee, Sujeong; An, Jeongho; et al, ACS APPLIED MATERIALS & INTERFACES, v.15, no.49, pp.57404 - 57414, 2023-11 |
Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating Zhang, Shuai; Zhang, Shuye; Zhou, Hongzhi; Paik, Kyung-Wook; Ding, Tianran; Long, Weimin; Zhong, Sujuan; et al, MATERIALS CHARACTERIZATION, v.207, 2024-01 |
Fe-based high-entropy alloy with excellent mechanical properties enabled by nanosized precipitates and heterogeneous grain distribution Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05 |
Quantitative analysis of magnon characteristics with unidirectional magnetoresistance Lee, Nyun Jong; Jang, Heechan; Park, Eunkang; Lee, Ki-Seung; Jeong, Seyeop; Lee, Soogil; Park, Byong-Guk; et al, PHYSICAL REVIEW APPLIED, v.20, no.6, 2023-12 |
Fabrication of Al-Ni Alloys for Fast Hydrogen Production from Hydrolysis in Alkaline Water Kwon, JaeYoung; Eom, KwangSup; Kim, MinJoong; Toor, Ihsan; Oh, SeKwon; Kwon, HyukSang, MATERIALS, v.16, no.23, 2023-12 |
The phase decomposition in non-equimolar (ZrHfVNbMoW)Cx complex concentrated carbides via carbon content regulation Zhang, Wen; Li, Kunxuan; Chen, Lei; Shi, Zhan; Huo, Sijia; Wei, Boxin; Kang, Suk-Joong L.; et al, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.44, no.3, pp.1396 - 1403, 2024-03 |
Metallization of Targeted Protein Assemblies in Cell-Derived Extracellular Matrix by Antibody-Guided Biotemplating Song, Chang Woo; Ahn, Jaewan; Yong, Insung; Kim, Nakhyun; Park, Chan E.; Kim, Sein; Chung, Sung-Yoon; et al, ADVANCED SCIENCE, v.10, no.35, 2023-12 |
Toward thin and stable anodes for practical lithium metal batteries: A review, strategies, and perspectives Lee, Jiyoung; Jeong, Seung Hyun; Nam, Jong Seok; Sagong, Mingyu; Ahn, Jaewan; Lim, Haeseong; Kim, Il-Doo, ECOMAT, v.5, no.12, 2023-12 |
Enhanced interfacial adhesion of patterned Cu-graphene nanolayered composite Kim, Wonsik; Kim, Sang Min; Han, Seung Min, SCRIPTA MATERIALIA, v.241, 2024-03 |
Enhancing Efficiency of Low-Grade Heat Harvesting by Structural Vibration Entropy in Thermally Regenerative Electrochemical Cycles Choi, Ahreum; Song, You‐Yeob; Kim, Juyoung; Kim, Donghyeon; Kim, Min‐Ho; Lee, Seok Woo; Seo, Dong-Hwa; et al, ADVANCED MATERIALS, v.35, no.38, 2023-09 |
Computation-aided design of oxygen-ligand-steered single-atom catalysts: Sewing unzipped carbon nanotubes Kim, Dong Yeon; Jeong, Da Sol; Thangavel, Pandiarajan; Ha, Miran; Hwang, Hyuntae; Park, Yoo-Jong; Shin, Tae Joo; et al, CHEM, v.9, no.11, pp.3304 - 3318, 2023-11 |
Modifying subgap states with hydrogen incorporation from source/drain alloys for oxide phototransistors Jeong, Wooseok; Cho, Seong-In; Park, Sang-Hee Ko; Ko, Jong Beom, MATERIALS LETTERS, v.355, 2024-01 |
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
Using 4D-STEM to Map 3D Morphologies of 2D Materials Mireles, Adan; Shi, Chuqiao; Park, Jeongwon; Shin, Bongki; Sung, Suk Hyun; Ophus, Colin; Hovden, Robert; et al, MICROSCOPY AND MICROANALYSIS, v.29, no.1, pp.262 - 263, 2023-07 |
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