MS-Journal Papers(저널논문)
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Recent Items
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1
Advanced parametrization for the production of high-energy solid-state lithium pouch cells containing polymer electrolytes
Lee, Wonmi; Lee, Juho; Yu, Taegyun; Kim, Hyeong-Jong; Kim, Min Kyung; Jang, Sungbin; Kim, Juhee; Han, Yu-Jin; Choi, Sunghun; Choi, Sinho; Kim, Tae-Hee; Park, Sang-Hoon; Jin, Wooyoung; Song, Gyujin; Seo, Dong-Hwa; Jung, Sung-Kyun; Kim, Jinsoo, Nature Communications, v.15, no.1, 2024-12
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2
Abnormal martensitic transformation and morphology induced by chemical heterogeneity in additively manufactured maraging steel
노현빈; Han, Jeongho; Ryou, KenHee; Choi, Pyuck-Pa, SCRIPTA MATERIALIA, v.253, 2024-12
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Ferrite-enabled improvement of hydrogen embrittlement through strain partitioning in quenching and partitioning steels
Kim, Ki Jeong; Song, Sang Yoon; Lee, Gunjick; Kim, Hye-Jin; Um, Ho Yong; Hyun, Joo-Sik; Jung, Seung-Pill; Ryou, KenHee; Choi, Pyuck-Pa; Zargaran, Alireza; Lee, Myoung-Gyu; Sohn, Seok Su, MATERIALS SCIENCE AND ENGINEERING, v.913, 2024-10
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4
Ultra-high areal capacity, ultra-long life, dendrite-free sodium metal anode enabled by antimony-based Na-ion conducting artificial SEI layers
Moorthy, Megala; Thangavel, Ranjith; Krishnan Ganesan, Bala; Saha, Aditi; Hong, Seungbum; Lee, Yun-Sung, Chemical Engineering Journal, v.498, pp.155234, 2024-10
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Unveiling the Nanoscale Dielectric Gap and Its Influence on Ferroelectric Polarization Switching in Scanning Probe Microscopy
EOM, SEONGMUN; Kavle, Pravin; Kang, Deokyoung; Kim, Yeon-gyu; Martin, Lane W.; HONG, DANIEL SEUNGBUM, Advanced Functional Materials, 2024-09
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Mott neurons with dual thermal dynamics for spatiotemporal computing
Kim, Gwangmin; In, Jae Hyun; Lee, Younghyun; Rhee, Hakseung; Park, Woojoon; Song, Hanchan; Park, Juseong; Jeon, Jae Bum; Brown, Timothy D.; Talin, A. Alec; Kumar, Suhas; Kim, Kyung Min, NATURE MATERIALS, v.23, no.9, 2024-09
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7
Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09
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8
Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
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Advancing Charge Density in Temperature‐Dependent Amphiphile Metal–Organic Polyhedra‐Based Triboelectric Nanogenerators
Ippili, Swathi; Kumar, Gobbilla Sai; Sharma, Arti; Ko, Yoonah; Hong, Seungbum; Goddati, Mahendra; Saini, Haneesh; Lee, Jaebeom; Yang, Tae‐Youl; Siddhanta, Soumik; Jella, Venkatraju; Yoon, Soon‐Gil; Jayaramulu, Kolleboyina, Advanced Energy Materials, 2024-08
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10
Lateral Piezoelectricity of Alzheimer's Aβ Aggregates
Jang, Jinhyeong; Joo, Soyun; Yeom, Jiwon; Jo, Yonghan; Zhang, Jingshu; Hong, Seungbum; Park, Chan Beum, ADVANCED SCIENCE, 2024-08
Collection's Items (Sorted by Submit Date in Descending order): 7001 to 7020 of 7317
| Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal Sohn, WH; Bong, HH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.355, pp.231 - 240, 2003-08 |
| Dynamic mechanical properties of particle-reinforced EPDM composites Sohn, MS; Kim, KS; Hong, Soon-Hyung; Kim, JK, JOURNAL OF APPLIED POLYMER SCIENCE, v.87, pp.1595 - 1601, 2003-03 |
| Mechanical properties of WC–10Co cemented carbides sintered from nanocrystalline spray conversion processed powders Cha, SI; Kim, BK; Hong, Soon-Hyung, INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, v.19, no.6, pp.397 - 403, 2001 |
| Densification and conolidation of powders by equal channel angular pressing Yoon, SC; Hong, SI; Hong, Soon-Hyung; Kim, HS, MATERIALS SCIENCE FORUM, v.534-536, no.PART 1, pp.253 - 256, 2007 |
| Dynamic deformation and high velocity impact behaviors of Ti-6Al-4V alloys Kim, JY; Shim, IO; Kim, HK; Hong, SS; Hong, Soon-Hyung, MATERIALS SCIENCE FORUM, v.539-543, no.PART 3, pp.2269 - 2274, 2007 |
| Carbon nanotube reinforced metal matrix nanocomposites via equal channel angular pressing Quang, P; Jeong, YG; Yoon, SC; Hong, SI; Hong, Soon-Hyung; Kim, HS, MATERIALS SCIENCE FORUM, v.534-536, no.PART 1, pp.245 - 248, 2007 |
| Microstructures and tensile behavior of carbon nanotube reinforced Cu matrix nanocomposites Kim, KT; Cha, Sl; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.430, pp.27 - 33, 2006-08 |
| Equal channel angular pressing of carbon nanotube reinforced metal matrix nanocomposites Quang, P; Jeong, YG; Hong, Soon-Hyung; Kim, HS, KEY ENGINEERING MATERIALS, v.326-328 I, no.0, pp.325 - 328, 2006 |
| Field-emission behavior of a carbon-nanotube-implanted Co nanocomposite fabricated from pearl-necklace-structured carbon nanotube/Co powders Cha, SI; Kim, KT; Arshad, SN; Mo, CB; Lee, KH; Hong, Soon-Hyung, ADVANCED MATERIALS, v.18, pp.553 - +, 2006-03 |
| Mechanical behavior of carbon/phenolic ablative composites for nozzle application Kim, PW; Hong, Soon-Hyung; Kim, YC; Yeh, BH; Won, YG, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.1153 - 1158, 2000-01 |
| Anisotropic mechanical behavior of three dimensional glass fabric reinforced composites Lee, HS; Hong, Soon-Hyung; Lee, JR; Kim, YK, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1183 - 1188, 2000 |
| Development and Properties of Tungsten-bearing Stainless Maraging Steel Suk, Jin I; Park, Chang N; Hong, Soon-Hyung; Kim, Young-Gil, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.138, no.2, pp.267 - 273, 1991-06 |
| HIGH-TEMPERATURE DEFORMATION-BEHAVIOR OF 20 VOL-PERCENT SICW/2024AL METAL-MATRIX COMPOSITE KIM, HY; Hong, Soon-Hyung, SCRIPTA METALLURGICA ET MATERIALIA, v.30, no.3, pp.297 - 302, 1994-02 |
| Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, J.-H.; Chung, C.-K.; Paik, Kyung-Wook; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328, no.0, pp.517 - 520, 2006 |
| Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability Kim, Hyoung-Joon; Chung, Chang-Kyu; Kwon, Yong-Min; Yim, Myung-Jin; Hong, Soon-Min; Jang, Se-Young; Moon, Young-Joon; et al, JOURNAL OF ELECTRONIC MATERIALS, v.36, pp.56 - 64, 2007-01 |
| Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.27, pp.77 - 84, 2007-01 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
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