MS-Journal Papers(저널논문)
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1
Advanced parametrization for the production of high-energy solid-state lithium pouch cells containing polymer electrolytes
Lee, Wonmi; Lee, Juho; Yu, Taegyun; Kim, Hyeong-Jong; Kim, Min Kyung; Jang, Sungbin; Kim, Juhee; Han, Yu-Jin; Choi, Sunghun; Choi, Sinho; Kim, Tae-Hee; Park, Sang-Hoon; Jin, Wooyoung; Song, Gyujin; Seo, Dong-Hwa; Jung, Sung-Kyun; Kim, Jinsoo, Nature Communications, v.15, no.1, 2024-12
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Abnormal martensitic transformation and morphology induced by chemical heterogeneity in additively manufactured maraging steel
노현빈; Han, Jeongho; Ryou, KenHee; Choi, Pyuck-Pa, SCRIPTA MATERIALIA, v.253, 2024-12
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Ferrite-enabled improvement of hydrogen embrittlement through strain partitioning in quenching and partitioning steels
Kim, Ki Jeong; Song, Sang Yoon; Lee, Gunjick; Kim, Hye-Jin; Um, Ho Yong; Hyun, Joo-Sik; Jung, Seung-Pill; Ryou, KenHee; Choi, Pyuck-Pa; Zargaran, Alireza; Lee, Myoung-Gyu; Sohn, Seok Su, MATERIALS SCIENCE AND ENGINEERING, v.913, 2024-10
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4
Ultra-high areal capacity, ultra-long life, dendrite-free sodium metal anode enabled by antimony-based Na-ion conducting artificial SEI layers
Moorthy, Megala; Thangavel, Ranjith; Krishnan Ganesan, Bala; Saha, Aditi; Hong, Seungbum; Lee, Yun-Sung, Chemical Engineering Journal, v.498, pp.155234, 2024-10
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Unveiling the Nanoscale Dielectric Gap and Its Influence on Ferroelectric Polarization Switching in Scanning Probe Microscopy
EOM, SEONGMUN; Kavle, Pravin; Kang, Deokyoung; Kim, Yeon-gyu; Martin, Lane W.; HONG, DANIEL SEUNGBUM, Advanced Functional Materials, 2024-09
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Mott neurons with dual thermal dynamics for spatiotemporal computing
Kim, Gwangmin; In, Jae Hyun; Lee, Younghyun; Rhee, Hakseung; Park, Woojoon; Song, Hanchan; Park, Juseong; Jeon, Jae Bum; Brown, Timothy D.; Talin, A. Alec; Kumar, Suhas; Kim, Kyung Min, NATURE MATERIALS, v.23, no.9, 2024-09
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7
Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09
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8
Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
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Advancing Charge Density in Temperature‐Dependent Amphiphile Metal–Organic Polyhedra‐Based Triboelectric Nanogenerators
Ippili, Swathi; Kumar, Gobbilla Sai; Sharma, Arti; Ko, Yoonah; Hong, Seungbum; Goddati, Mahendra; Saini, Haneesh; Lee, Jaebeom; Yang, Tae‐Youl; Siddhanta, Soumik; Jella, Venkatraju; Yoon, Soon‐Gil; Jayaramulu, Kolleboyina, Advanced Energy Materials, 2024-08
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10
Lateral Piezoelectricity of Alzheimer's Aβ Aggregates
Jang, Jinhyeong; Joo, Soyun; Yeom, Jiwon; Jo, Yonghan; Zhang, Jingshu; Hong, Seungbum; Park, Chan Beum, ADVANCED SCIENCE, 2024-08
Collection's Items (Sorted by Submit Date in Descending order): 6941 to 6960 of 7317
| Molecular Dynamic Simulation of Coalescence between Silver and Palladium Clusters Lee, Hyuck Mo; Kim, Hyun You; Lee, Sung Hoon; Kim, Hyoung Gyu; Ryu, Ji Hoon, Mater. Trans., Vol. 48, pp. 455-459 (2007), 2007 |
| Diffusional solidification behavior in 304 stainless steel Lee, HyuckMo; Bae, JS; Soh, JR; Kim, SK; Lee, YD, MATERIALS TRANSACTIONS JIM, v.39, no.6, pp.633 - 639, 1998-06 |
| Study on cap closure mechanism of single-walled carbon nanotubes by molecular dynamics Han, SS; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.5, pp.1437 - 1441, 2004-05 |
| Thermodynamics-aided alloy design and evaluation of Pb-free solders fdr high-temperature applications Kim, Jong Hoon; Jeong, Sang Won; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.43, no.8, pp.1873 - 1878, 2002-08 |
| Abnormal grain growth of Ni3Sn4 at Sn-33Ag/Ni interface Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.3, pp.710 - 713, 2004-03 |
| Nanomechanical behavior of beta-SiC nanowire in tension: Molecular dynamics simulations Kim, TY; Han, SS; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.5, pp.1442 - 1449, 2004-05 |
| Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11 |
| Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy Yoon, SW; Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.44, no.2, pp.290 - 297, 2003-02 |
| Photobleaching of sol-gel-derived germanium oxide glass thin films Jang, JH; Koo, J; Bae, Byeong-Soo, JOURNAL OF MATERIALS RESEARCH, v.15, no.2, pp.282 - 284, 2000-02 |
| A new low-resistance antifuse with planar metal/dielectric/poly-Si/dielectric/metal structure Baek, JT; Chung, SH; Kang, SW; Ahn, Byung Tae; Yoo, Hyung Joun, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.3B, pp.1642 - 1645, 1997-03 |
| Formation of TiO2 thin films using NH3 as catalyst by metalorganic chemical vapor deposition Jung, Sung-Hoon; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1, v.40, no.5A, pp.3147 - 3152, 2001-05 |
| Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06 |
| A HIGH-SPEED SI BIPOLAR-TRANSISTOR WITH SAVEN - (SELF-ALIGNED DEVICE USING VERTICAL NITRIDE) KOO, YS; Kang, Sang-Won; AN, C, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.31, no.8, pp.2400 - 2406, 1992-08 |
| Low-temperature crystallization of amorphous Si films by metal adsorption and diffusion Sohn, DK; Lee, JN; Kang, SW; Ahn, Byung Tae, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.2B, pp.1005 - 1009, 1996-02 |
| AC frequency characteristics of coplanar impedance sensors as design parameters Hong, J; Yoon, DS; Kim, SK; Kim, TS; Kim, S; Pak, EY; No, Kwangsoo, LAB ON A CHIP, v.5, no.3, pp.270 - 279, 2005 |
| Effects of Deposition Temperature on the microstructure of MOCVD Y1Ba2Cu3O7-x Thin-Films Cho, CY; Hwang, D; No, Kwangsoo; Chun , Soung Soon; Kim, SH, JOURNAL OF MATERIALS SCIENCE, v.28, no.11, pp.2915 - 2922, 1993-06 |
| The Effects of The Sintering Schedule on The Superconducting Properties of Bi(Pb)-Sr-Ca-Cu-O Thick-Films Kim, DH; Um, WS; No, Kwangsoo; Kim, Ho Gi, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.5, no.3, pp.145 - 150, 1992-03 |
| Enhancement of the film growth rate by promoting iodine adsorption in the catalyst-enhanced chemical vapor deposition of Cu Kwon, OK; Lee, HB; Kang, Sang-Won; Park, HS, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A, v.20, no.2, pp.408 - 412, 2002 |
| Growth of carbon nanotubes on the glass substrate for flat panel display applications Kim, J; No, Kwangsoo, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.16, no.6-7, pp.979 - 982, 2002-03 |
| COMPOSITION OF M2C PHASE IN TEMPERING OF HIGH CO-NI STEELS Lee, HyuckMo; GARRATTREED, AJ; ALLEN, SM, SCRIPTA METALLURGICA ET MATERIALIA, v.25, no.3, pp.685 - 688, 1991-03 |
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