| 31 | Otimization of CNT Growth Conditions Using Taguchi Methods 노광수, 한국요업학회 추계학술발표대회, 한국요업학회, 2000-01-01 |
| 32 | The Effects of Boron & Nitrogen on the Creep-Fatigue Interaction Behaviors in 316L Stainless Steels 남수우, Proc. of the Symposium on Nuclear Materials and Fuel 2000, pp.171 - 177, 2000 |
| 33 | 저전압용 SrTiO3:Pr,Al,Ga 형광체의 발광특성의 열화에 관한 연구 전덕영, 한국세라믹학회 춘계학술대회, pp.160 -, 한국세라믹학회, 2001-01-01 |
| 34 | Investigation of Fatigue Characteristics of Domain in Pb(Zr0.52Ti0.48)O3(PZT) Thin Films using Atomic Force Microscopy(AFM) No, Kwangsoo; Song, Han Wook, FERAM, 2001-01-01 |
| 35 | Diffuse Dielectric Anomaly in Perovskite Oxide Materials Choi, Si-Kyung; Kang, Byung Sung, 2001 MRS Fall Meeting, pp.76 -, 2001 |
| 36 | Development of Balloon Expandable Intravascular Stent by Laser Micromachining Process Hong, Soon-Hyung, pp.9 - 21, 2002-08-01 |
| 37 | Growth and Characterization of High Tunability Ba0.5Sr0.5TiO3 Thin Films for Microwave Application. Kim, Ho Gi, ISAF, 2000-01-01 |
| 38 | Effects of Nickel on the Repassivation Kinetics of Fe-20Cr-xNi (x=0-80) Alloys in a Chloride Solution Kwon, Hyuk-Sang; Cho, Eun AE, Research in Progress Symposium at CORROSION NACE 2000, Annual conference & Exposition., pp.30 - 32, 2000-01-01 |
| 39 | Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04 |
| 40 | Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites for Electronic Packaging Applications Hong, Soon Hyung, Spring Meeting of the Korean Society for Composites Materials, pp.190 - 194, 복합재료학회, 2000-04-01 |
