Search
Results 1491-1492 of 1492 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01 | |
| A novel angular rate sensor employing flexural plate wave No, Kwangsoo; Wee, Dang-Moon, 1999 IEEE International Ultrasonics Symposium, pp.493 - 496, IEEE, 1999-10-18 |