| 11 | High Temperature Creep Behavior of Discontinuously Reinforced SiC/2124Al Metal Matrix Composites Hong, Soon Hyung, Fall Meeting of the Korean Society for Composite Materials, 한국복합재료학회, 1998-01-01 |
| 12 | Development of Method of Homogeneity Measurement of U3Si/Al Powder Mixture for Research Reactor Hong, Soon Hyung; Sohn, WH; Kim, CK; Kim, KH; Ko, YM, Korea Nuclear Society Spring Meeting, pp.256 - 256, 1998-01-01 |
| 13 | High Temperature Deformation Behavior and Flow Softening Mechanism of TiAl Intermetallic Compound Hong, Soon Hyung, 151, 1998-01-01 |
| 14 | Effect of microstructure on superplasticity of W-containing duplex stainless steels Han, YS; Hong, Soon Hyung, Proceedings of the 1995 124th TMS Annual Meeting, pp.101 - 107, TMS, 1995-02-13 |
| 15 | Relationship between Elastic Modulus and Texture of Gold Bonding Wire for Electronic Packaging Applications Hong, Soon Hyung, pp.15 - 22, 2001-01-01 |
| 16 | Shear Behavior of Honeycomb Composites with increasing Temperature Hong, Soon Hyung, The Korean Society for Composite Materials 85, 한국복합재료학회, 1997-01-01 |
| 17 | Mechanical properties of intermetallic/metal laminated composite by SHS reaction Hong, Soon Hyung, Fall meeting of Korean Society of Composite Materials, pp.60 - 63, 복합재료학회, 2002-01-01 |
| 18 | Fabrication Process and Characterization of High Thermal Conductivity-Low CTE SiCp/Al Metal Matrix Composites by Pressure Infiltration Casting Process Hong, Soon Hyung, Fall Meeting of the Korean Society for Composite Materials, pp.83 - 87, 복합재료학회, 1999-10-01 |
| 19 | Fabrication Process of High Thermal Conductivity and Low CTE SiCp/Al Metal Matrix Composite for Electronic Packaging Applications Hong, Soon Hyung, Spring Meeting of the Korean Society for Composite Mateirals, pp.109 - 113, 한국복합재료학회, 1999-01-01 |
| 20 | Characterization of Mechanical Properties of Electrodeposited Cu Thin Films by Nanoindentation Technique Hong, Soon Hyung, pp.8 - 11, 2002-10-01 |
