The design and development of an automatic assembly machine for microelectronic components is described. The machine uses multiple microprocessors to accomplish its tasks, which include process supervision, visual pattern recognition, and information display. The system is flexible and reliable due to its modular design and the use of a structured supervisor with diagnosis capability. It minimizes manual operation by means of automatic measurements and corrects object orientation and component size with the aid of a vision system. The control system was implemented in real time on a laboratory semiconductor die bonding machine. In a test, it was possible to reduce the bonding cycle time to 0.8 s/die (0.8-7.0 mm sized die).