10Gbps class parallel optical receiver module with low inter-channel crosstalk = 채널간 간섭을 억제한 다채널 10Gbps급광연결 수신단 모듈 연구

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For future high-end high data rate system, 10 Gb/s optical receiver array with low inter-channel crosstalk is realized by exploiting an InGaP/GaAs HBT technology in a three-dimensional multilayer LTCC (low temperature co-firing ceramics) module. In chapter II, as a preliminary research, single ended TIA circuit investigation shows that proposed inductive buffer peaking technique gives most effective results in bandwidth extension with low power consumption. IC evaluation of inductive buffer peaking TIA with 3nH on-chip inductor shows 8.9GHz of bandwidth with 65mW power consumption. In chapter III, Single channel InGaP/GaAs HBT TIA for multi channel receiver with three cascading neutralization gain stages shows a bandwidth of 7.5GHz with fully differential I/O. Especially in this work, low supply voltage operation circuit maintaining differential topology is focused due to the limitations in conventional wideband differential gain stage. In chapter IV, novel LTCC module structure for parallel receiver enabled to get rid of on-chip buses for supply voltage and ground which causes two significant interchannel crosstalk paths. Frequency domain measurement revealed that LTCC embedded bus module shows -27 dB crosstalk at 5 GHz and -15 dB at 10 GHz. BER test showed that LTCC embedded bus module has input sensitivity of -9.5dBm for the error rate of $10^{-12}$. Careful network calculation based on measured BER shows that input sensitivity of LTCC embedded bus can be improved to -12.5dBm with conventional device technology. LTCC embedded bus module shows only 0.8dB penalty and its clear significance in suppressing inter-channel crosstalk at 10Gbps comparing to any other research results. On the basis of this remarkable modification, LTCC embedded bus module shows successful receiver specifications to be adapted to OIF VSR5 link configuration without any link budget degradation.
Advisors
Park, Chul-Soonresearcher박철순researcher
Description
한국정보통신대학교 : 공학부,
Publisher
한국정보통신대학교
Issue Date
2005
Identifier
392511/225023 / 000995420
Language
eng
Description

학위논문(박사) - 한국정보통신대학교 : 공학부, 2005, [ i, 88 p. ]

Keywords

LTCC substrate; flip-chip; Channel crosstalk; parallel optical interconnects; 다채널 광연결; LTCC기판; 플립칩; 채널간 간섭

URI
http://hdl.handle.net/10203/54543
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=392511&flag=dissertation
Appears in Collection
School of Engineering-Theses_Ph.D(공학부 박사논문)
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