학위논문(석사) - 한국과학기술원 : 신소재공학과, 2005.2, [ iii, 77 p. ]
접착력; 하부금속층; 무전해 도금; ICP enhanced bias sputtering; 니켈 씨드층; 스크레치 테스트; scratch teston; adhesion; UBM; Electroless plating; ICP enhanced bias sputtering; Ni seed layer
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.