ECR-PECVD 법으로 증착한 TiN 박막의 Cu에 대한 확산방지막 특성The barrier property of ECR-PECVD TiN film against Cu diffusion
- Advisors
- 이원종researcher; Lee, Won-Jeongresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1997
- Identifier
- 113146/325007 / 000953438
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1997.2, [ [ii], 60 p. ]
- Keywords
TiN; ECR-플라즈마 화학기상증착법; 확산방지막; Diffusion barrier; TiN; ECR-PECVD
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.