Cu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Cu
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이원종 | - |
| dc.contributor.advisor | Lee, Won-Jong | - |
| dc.contributor.author | 박혜련 | - |
| dc.contributor.author | Park, Hye-Lyun | - |
| dc.date.accessioned | 2011-12-15T01:04:30Z | - |
| dc.date.available | 2011-12-15T01:04:30Z | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=177284&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50270 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ ii, 113 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 유도결합플라즈마 | - |
| dc.subject | 확산방지막 | - |
| dc.subject | TaSiN | - |
| dc.subject | TaN | - |
| dc.subject | 금속유기물화학증착법 | - |
| dc.subject | MOCVD | - |
| dc.subject | transformer coupled plasma | - |
| dc.subject | diffusion barrier | - |
| dc.subject | TaSiN | - |
| dc.subject | TaN | - |
| dc.title | Cu 확산방지용 TCP MOCVD Ta(Si)N 박막 증착 및 특성에 관한 연구 | - |
| dc.title.alternative | Deposition and characterization of TCP MOCVD Ta(Si)N thin films as diffusion barrier for Cu | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 177284/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000955155 | - |
| dc.contributor.localauthor | 박혜련 | - |
| dc.contributor.localauthor | Park, Hye-Lyun | - |
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