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Results 1-1 of 1 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
구리 CECVD를 이용한 3-D packaging용 through-Si via/trench filling에 대한 연구 = Through-Si via/trench filling for 3-D packaging by copper catalyst-enhanced chemical vapor depositionlink

이도선; Lee, Do-Seon; 이원종; Lee, Won-Jong, 한국과학기술원, 2009

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