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Results 1-1 of 1 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure

Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

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