유전 경화 모니터링을 이용한 후판 복합재료의 스마트 성형 기법 = Smart cure process for thick composites using dielectric cure monitoring

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Advisors
이대길researcherLee, Dai-Gilresearcher
Description
한국과학기술원 : 기계공학전공,
Publisher
한국과학기술원
Issue Date
2003
Identifier
231049/325007  / 020005091
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 기계공학전공, 2003.8, [ x, 105 p. ]

Keywords

복합재료; 후판; 경화; 유전; 성형; process; composites; thick; cure; dielectric

URI
http://hdl.handle.net/10203/43206
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=231049&flag=dissertation
Appears in Collection
ME-Theses_Ph.D.(박사논문)
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