학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2009.2, [ ix, 69 p. ]
Electromagnetic Bandgap Structure; Power/Ground Noise; Multi-layer Package; Multi-layer Printed Circuit Board; Vertical Multi-stacked EBG; EBG 구조; 전력/접지 잡음; 다층 패키지; 다층 PCB; 수직 다층 EBG; Electromagnetic Bandgap Structure; Power/Ground Noise; Multi-layer Package; Multi-layer Printed Circuit Board; Vertical Multi-stacked EBG; EBG 구조; 전력/접지 잡음; 다층 패키지; 다층 PCB; 수직 다층 EBG
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