Vertical multi-stacked electromagnetic bandgap structure for power/ground noise isolation in the multi-layer package and printed circuit board = 다층 패키지 및 PCB에서의 전력/접지 잡음 억제를 위한 수직의 다층 적층 EBG 구조

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dc.contributor.advisorKim, Joung-Ho-
dc.contributor.advisor김정호-
dc.contributor.authorYoo, Jeong-Sik-
dc.contributor.author유정식-
dc.date.accessioned2011-12-14T02:07:55Z-
dc.date.available2011-12-14T02:07:55Z-
dc.date.issued2009-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=308832&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/38712-
dc.description학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2009.2, [ ix, 69 p. ]-
dc.description.abstractIn this paper, a novel electromagnetic bandgap(EBG) structure with a significantly extended noise isolation is proposed. So we called a vertical multi-stacked EBG (VMS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The VMS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in multi-layer System-in-Package (SiP) and Printed Circuit Board applications. The proposed VMS-EBG structure was analyzed by using an analytical modeling method for mushroom-type EBG unit cell. Design approach was enabled by combining multi EBG layers embedded between each power and ground plane pairs. The multi EBG layers had different band gaps from using different cell sizes. In this paper, we embedded two kinds of EBG layer in each multi-layer power ground plane pairs. Enhanced wideband suppression of the SSN coupling was validated using a 12.5 GHz noise stop bandwidth with 30 dB isolation in frequency domain measurements up to 20 GHz. LTCC-based X/Ku-band transceiver SiP with VMS-EBG was fabricated for validating the effect of the proposed VMS-EBG structure. The fabricated transceiver SiP is composed of Ku-band transceiver. The effect of VMS-EBG which gives 30dB isolation over Ku-band range was demonstrated through frequency domain measurement.eng
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectElectromagnetic Bandgap Structure-
dc.subjectPower/Ground Noise-
dc.subjectMulti-layer Package-
dc.subjectMulti-layer Printed Circuit Board-
dc.subjectVertical Multi-stacked EBG-
dc.subjectEBG 구조-
dc.subject전력/접지 잡음-
dc.subject다층 패키지-
dc.subject다층 PCB-
dc.subject수직 다층 EBG-
dc.subjectElectromagnetic Bandgap Structure-
dc.subjectPower/Ground Noise-
dc.subjectMulti-layer Package-
dc.subjectMulti-layer Printed Circuit Board-
dc.subjectVertical Multi-stacked EBG-
dc.subjectEBG 구조-
dc.subject전력/접지 잡음-
dc.subject다층 패키지-
dc.subject다층 PCB-
dc.subject수직 다층 EBG-
dc.titleVertical multi-stacked electromagnetic bandgap structure for power/ground noise isolation in the multi-layer package and printed circuit board = 다층 패키지 및 PCB에서의 전력/접지 잡음 억제를 위한 수직의 다층 적층 EBG 구조-
dc.typeThesis(Master)-
dc.identifier.CNRN308832/325007 -
dc.description.department한국과학기술원 : 전기및전자공학전공, -
dc.identifier.uid020073334-
dc.contributor.localauthorKim, Joung-Ho-
dc.contributor.localauthor김정호-
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EE-Theses_Master(석사논문)
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