Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation = 패키지 및 보드의 연계 설계 및 시뮬레이션을 위한 구조 분할 방법을 이용한 계층적 전력 접지망의 모델링

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With the increase of clock speed and power dissipation, and the decrease of level of power supply, the simultaneous switching noise issue will be more important for reliability of system. The mechanism of SSN has three facts, an amount of current flows by operating logics, the frequency of clock signal, and the impedance of total system. Among them, to control and estimate the impedance of total system can be a new challenge for high performance system. The difficulty to grasp the impedance of total system is that hierarchical power/ground network which is composed of board, package and chip for general system has complicated changes of impedance. In this dissertation, we will propose modeling of hierarchical power/ground network by using the resonant cavity model and the segmentation method for the fast and accurate acquisition of impedance of total power/ground network in system. For it, two of new modeling issues will be introduced. One is the inter-plane effect which is made by power plane of package and ground plane of board when independent power/ground networks of package and board are merged. Another is the fringing effect which is caused by the assumption of the resonant cavity model. By applying new issues on hierarchical power/ground network, total modeling procedure of it will be constructed. Additional planes for compensating the fringing effect in package, a detailed procedure of conversion asymmetric field distribution in inter-plane to symmetric one by using an image theory will be proposed. For them, the result of parameter sweeps in package and inter-plane will be shown. The lumped model, such as capacitor, inductor, and transmission line, for structures of vias and balls, and effective permittivity in inter-plane will be indicated, too. We will verify the validity of the proposed model for hierarchical power/ground network by comparing with the impedance of measurement and 3D full wave simulation in frequency domain, and the voltage of them i...
Kim, Joung-Horesearcher김정호researcher
한국과학기술원 : 전기및전자공학전공,
Issue Date
255500/325007  / 020043130

학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2006.2, [ xii, 66 p. ]


Package/Board Co-Simulation; Package/Board Co-Design; Segmentation Method; Hierarchical Power/Ground Network; Inter-plane Effect; 연계 시뮬레이션; 연계 설계; 구조 분할 방법; 계층적 전력 접지망; Fringing Effect

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