Slot transmission line model of interconnection line crossing split ground plane on high-speed multi-layer board = 고속 다층기판에서 분할된 접지 평면 위를 지나는 인터커넥션의 슬롯라인 모델

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In this paper, we have analyzed the effects of split power/ground plane on high-speed digital printed circuit board experimentally and numerically. Firstly, we have proposed equivalent circuit model of the signal traces, when the signal traces crosses the ground slot. Previously, when modeling a signal trace crossing a ground slot, the ground slot has been modeled as a simple inductor or inductor-capacitor usually. But the new proposed model is based on a slot transmission line model. The proposed model is more intuitive and gives more accurate results for both reflection and crosstalk simulation. Next, we have proposed some slot shapes to reduce the crosstalk and EMI including multi-layer structures. The crosstalk and EMI of the structures were simulated through the method of moments (MOM). Considering the isolation property, we found the best design of all proposed structure is strip line structure with tapered ground slot.
Advisors
Eom, Hyo-Joonresearcher엄효준researcher
Description
한국과학기술원 : 전기및전자공학전공,
Publisher
한국과학기술원
Issue Date
2002
Identifier
174061/325007 / 020003134
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2002.2, [ vii, 58 p. ]

Keywords

modeling; ground; split; microstrip; interconnection; 인터커넥션; 마이크로스트립; 모델링; 접지; 분할

URI
http://hdl.handle.net/10203/37531
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=174061&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
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