하이브리드 적외선 감지 소자를 위한 인듐 범프의 연구The study of indium bump for hybrid infrared focal plane array

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Advisors
이희철researcherLee, Hee-Cheulresearcher
Description
한국과학기술원 : 전기및전자공학과,
Publisher
한국과학기술원
Issue Date
1997
Identifier
114263/325007 / 000953623
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 1997.2, [ ii, 56 p. ]

Keywords

하이브리드 적외선 감지 소자; 인듐 범프; 플립 칩 본딩; Flip-chip bonding; Hybrid infrared focal plane array; Indium bump

URI
http://hdl.handle.net/10203/36961
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=114263&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
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