Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology

Abstract

The development of hybrid solder for chip packing is a major 3D packaging research topic. The incorporation of with low melting points into solder materials has been used in low-temperature packaging. Hybrid solder struggles to enhance low-temperature solder efficiency and mechanical properties. This work examined the effects of Co elements on microstructure and intermetallic compound (IMC) morphology of SAC305-SnBi-Co hybrid solder generated by reflow welding on electroless nickel immersion gold (ENIG) substrate at various temperatures. Moreover, mechanical characteristics and failure behavior of joints were extensively explored. The results show that the addition of 0.05% Co reduced the melting range of the solder and improved the wettability of SnBi solder. According to transmission electron microscopes (TEM) and electron diffraction spots (EDS), the crystal structure of the grains is (Cu, Co)(6)Sn-5 basic-centered monoclinic crystal. Fourier analysis of high-resolution images yields deformed lattice fringes, indicating that Co atoms fill Cu6Sn5's lattice gap in IMC. The shear strength of SAC305/SnBi hybrid solder joints with Co rises and then decreases with temperature. The highest shear strength of solder joints with 0.05% Co (40 nm) is 73.2 MPa at 220 degrees C, whereas joints with 0.1%Co are 67.5 MPa. Combined with the fracture morphology, the proportion of IMC fracture mode decreased after adding Co element