Cryogenic RF Transistors and Routing Circuits Based on 3D Stackable InGaAs HEMTs with Nb Superconductors for Large-Scale Quantum Signal Processing

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dc.contributor.authorJeong, Jaeyongko
dc.contributor.authorKim, Seongkwangko
dc.contributor.authorSuh, Yoon-Jeko
dc.contributor.authorLee, Jisungko
dc.contributor.authorChoi, Joonyoungko
dc.contributor.authorPark, Juhyukko
dc.contributor.authorKim, Joon Pyoko
dc.contributor.authorKim, Bong Hoko
dc.contributor.authorJo, Younjungko
dc.contributor.authorPark, Seung-Youngko
dc.contributor.authorKim, Jongminko
dc.contributor.authorKim, Sanghyeonko
dc.date.accessioned2023-11-22T06:03:36Z-
dc.date.available2023-11-22T06:03:36Z-
dc.date.created2023-11-22-
dc.date.issued2023-06-
dc.identifier.citation2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023-
dc.identifier.urihttp://hdl.handle.net/10203/315038-
dc.description.abstractCryogenic RF transistors and routing circuits operating with extremely low power are essential as control/readout electronics for future large-scale quantum computing (QC) systems. In this work, we demonstrate 3D stackable InGaAs HEMT-based cryogenic RF transistors and routing circuits integrated with Nb superconductors for ultra-low power operation. As a result, we achieve a record high unity current gain cutoff frequency (fT) of 601 GHz and unity power gain cutoff frequency (fMAX) of 593 GHz at 4 K with the smallest power dissipation among ever reported cryogenic RF transistors. Furthermore, using a novel structure with Nb superconductor and III-V heterostructure hybrid interconnect of the routing circuits, we achieve high-performance routing circuits with 41% lower power dissipation compared to the conventional structure.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleCryogenic RF Transistors and Routing Circuits Based on 3D Stackable InGaAs HEMTs with Nb Superconductors for Large-Scale Quantum Signal Processing-
dc.typeConference-
dc.identifier.scopusid2-s2.0-85167573931-
dc.type.rimsCONF-
dc.citation.publicationname2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023-
dc.identifier.conferencecountryJA-
dc.identifier.conferencelocationKyoto-
dc.identifier.doi10.23919/VLSITechnologyandCir57934.2023.10185262-
dc.contributor.localauthorKim, Sanghyeon-
dc.contributor.nonIdAuthorSuh, Yoon-Je-
dc.contributor.nonIdAuthorLee, Jisung-
dc.contributor.nonIdAuthorChoi, Joonyoung-
dc.contributor.nonIdAuthorJo, Younjung-
dc.contributor.nonIdAuthorPark, Seung-Young-
dc.contributor.nonIdAuthorKim, Jongmin-
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EE-Conference Papers(학술회의논문)
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