(The) complex formation between helical poly(L-proline) and helical poly (L-glutamic acid) through hydrogen bonding나선 구조를 갖는 폴리-엘-프로린과 폴리-엘-글루타민산 사이의 수소결합을 통한 복합체 형성에 관한 연구 ;

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Part Ⅰ. The Complex Formation between Helical Poly(L-proline) and Helical Poly(L-glutamic acid) through Hydrogen Bonding: The complex formation between helical Poly-L-glutamic acid (PLGA) and helical Poly-L-proline(PLP) was studied in methanol-water cosolvent in which the ratio of mathanol:water was 2:1 and in propanol-water cosolvent of 9:1. For the study, the reduced viscosity, circular dichroism, pH, and molar absorptivity were measured. The experimental results exhibit that the interpolymer complex was formed between helical PLGA and helical PLP through hydrogen bonding. When the complex was formed, the unit mole ratio of PLGA:PLP(Ⅱ) is 2:1 and PLGA:PLP(Ⅰ) is 1.5:1, the ability of complex formation of PLP(Ⅱ) with PLGA is better than that of PLP(Ⅰ). On complexation the conformations of PLGA and PLP change, the change is more enhanced in PLGA-PLP(Ⅱ) than PLGA-PLP(Ⅰ) complex. The reason will be studied. Part Ⅱ. High Temperature Polymer Containing Organosilicone Compound A. The Dispersion of Polymethylsilsesquinoxane into Polyimide : Through the pretreatment of 4, 4``-oxy-dianiline(ODA) with polyhydrogenmethylsiloxane(PHMS) using sodium hydroxide as a catalyst and subsequent reaction of this pretreated PHMS-ODA with 3, 3``, 4, 4``-benzophenonetetracarboxylic dianhydride(BTDA), polysiloxane can be attached to the polyamic acid by the silyl ester bond. By the thermal treatment of this polysiloxane-polyamic acid compound, well dispersed polymethylsilsesquinoxane(PMSQ) into polyimide can be obtained. B. Thermal Study for the Crosslinked Organosilicone-Organic Copolymer: we made silicon-oxygen-carbon links by the reaction between dichlomethylvinyl silane and aromatic diol or imide that contains diol. These prepolymer or cyclic oligomer were cured at evaluated temperature. The crosslinking of polyorganosiloxane was achieved by Si-O-Si bond formation through the thermal oxidation of vinyl group that was attached to the silicone. Though the Si-O-C bond is very weak ...
Advisors
Jhon, Mu-Shik전무식
Description
한국과학기술원 : 화학과,
Publisher
한국과학기술원
Issue Date
1995
Identifier
101845/325007 / 000885453
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 화학과, 1995.8, [ ix, 75 p. ]

Keywords

POLYMETHYLSILSESQUINOXANE; Polyimide; Polypeptide-Polypeptide Complex; POLYORGANOOXYSILOXANE; 폴리올게노옥시실록세인; 폴리메틸실세스퀴 녹세인; 폴리이미드; 폴리펩타이드-폴리펩타이드 복합체

URI
http://hdl.handle.net/10203/31417
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=101845&flag=dissertation
Appears in Collection
CH-Theses_Ph.D.(박사논문)
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